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TM4C1237E6PZI

Texas Instruments

TM4C1237E6PZI by Texas Instruments

TM4C1237E6PZI by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, 131072 ROM words, and 32768 RAM bytes. It features 22-Ch 12-Bit ADC channels, CAN connectivity, and operates at a max clock frequency of 25 MHz. Ideal for industrial applications requiring high-speed data processing and extensive peripheral support.

Median Price

$10.363

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,070 parts In-Stock

1+ parts

$10.363

100+ parts

$8.448

1k+ parts

$5.632

10k+ parts

-

4,070

$10.363

$8.448

$5.632

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 55 parts In-Stock

1+ parts

$9.790

100+ parts

-

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55

$9.790

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Digiode

USA . 1,875 parts In-Stock

1+ parts

$9.845

100+ parts

-

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1,875

$9.845

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Vyrian

USA . 7,862 parts In-Stock

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7,862

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,023 parts In-Stock

1+ parts

$8.810

100+ parts

-

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4,023

$8.810

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Semicontronic

India . 3,930 parts In-Stock

1+ parts

$8.810

100+ parts

$8.590

1k+ parts

$8.546

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-

3,930

$8.810

$8.590

$8.546

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Corphita

USA . 1,357 parts In-Stock

1+ parts

$9.327

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-

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1,357

$9.327

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Continental Prestige Electronics

USA . 6,844 parts In-Stock

1+ parts

$9.790

100+ parts

-

1k+ parts

-

10k+ parts

$9.594

6,844

$9.790

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-

$9.594

Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$9.986

100+ parts

$9.986

1k+ parts

$9.986

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-

870

$9.986

$9.986

$9.986

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AZTECH Wire

Italy . 1,150 parts In-Stock

1+ parts

$11.300

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-

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1,150

$11.300

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Microchip USA

USA . 2,806 parts In-Stock

1+ parts

$25.960

100+ parts

$25.590

1k+ parts

$25.410

10k+ parts

$25.220

2,806

$25.960

$25.590

$25.410

$25.220

Corohmni

South Africa . 904 parts In-Stock

1+ parts

$65.263

100+ parts

-

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904

$65.263

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Parana Technologies

USA . 2,189 parts In-Stock

1+ parts

$75.973

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2,189

$75.973

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DigiPath Technology Company

USA . 214 parts In-Stock

1+ parts

$83.656

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214

$83.656

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ChromeModa Solutions

Germany . 2,912 parts In-Stock

1+ parts

$85.363

100+ parts

$69.998

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2,912

$85.363

$69.998

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IDEA Electronic Components Group

UK . 1,780 parts In-Stock

1+ parts

$85.363

100+ parts

$81.095

1k+ parts

$76.827

10k+ parts

-

1,780

$85.363

$81.095

$76.827

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Argo Parts USA

USA . 2,928 parts In-Stock

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2,928

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Infinite Electronics LLP (Excess)

. 2,006 parts In-Stock

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2,006

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Netroflash

USA . 500 parts In-Stock

1+ parts

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$9.594

1k+ parts

$9.300

10k+ parts

$9.105

500

-

$9.594

$9.300

$9.105

Robosynatics

Brazil . 200 parts In-Stock

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200

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Lucentia Tech

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$0.295

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$0.295

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$0.295

200

-

$0.295

$0.295

$0.295

Overview

Unlock endless possibilities with the TM4C1237E6PZI microcontroller by Texas Instruments. Designed with top-notch quality and precision, this product offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers reliable and efficient operation. With advanced features like multiple ADC channels, PWM channels, and connectivity options, customers can easily create innovative solutions for their projects. Trust Texas Instruments to provide you with the tools you need to bring your ideas to life. Elevate your creations today with the TM4C1237E6PZI microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space in the design.

Maximum Supply Voltage: 1.32 V

Operates efficiently within a low maximum supply voltage range, suitable for low power applications.

Package Shape: SQUARE

Square package shape facilitates uniform and efficient PCB layout, optimizing space usage.

Bit Size: 32

32-bit architecture provides high processing power and performance for demanding applications.

Power Supplies (V): 1.2,3.3

Supports multiple power supply voltages, offering flexibility in system design and compatibility with various peripherals.

No. of Terminals: 100

Ample number of terminals enable versatile connectivity options and peripherals integration.

Minimum Supply Voltage: 1.08 V

Operates effectively with a low minimum supply voltage, suitable for energy-efficient designs.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

CPU Family: CORTEX-M4F

Utilizes Cortex-M4F architecture for high efficiency and performance in real-time processing applications.

Minimum Operating Temperature: -40 °C

Can withstand extreme low temperatures, making it suitable for industrial and outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides a durable and reliable terminal finish for long-term use and solder joint integrity.

ADC Channels: YES

Integrated ADC channels enable analog signal conversion for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels enhance data transfer efficiency and offload CPU for multitasking operations.

Width: 14 mm

Compact width size enables space-saving PCB design and flexibility in product form factor.

Data EEPROM Size: 2K

Provides sufficient non-volatile memory for storing critical data and application settings.

Maximum Clock Frequency: 25 MHz

High clock frequency offers fast processing speed and real-time performance for time-critical applications.

Peripherals: BOD, COMPARATOR(3), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Offers a wide range of integrated peripherals for enhanced functionality and connectivity options.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections on the PCB for reliable operation.

ROM Words: 131072

Large ROM size accommodates complex program storage and firmware requirements for diverse applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form offers strong mechanical support and excellent solder joint reliability during PCB assembly.

Analog To Digital Convertors: 22-Ch 12-Bit

Multiple ADC channels with high resolution enable precise analog signal conversion for accurate sensor readings.

Nominal Supply Voltage: 1.2 V

Operates at a low nominal supply voltage, reducing power consumption and enhancing energy efficiency.

Connectivity: CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Diverse connectivity options ensure compatibility with various communication protocols and peripherals.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB layouts and miniaturization of the overall product size.

RAM Bytes: 32768

Sufficient RAM size for data storage and temporary program execution, enhancing multitasking capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture provides efficient data processing and control algorithms for optimized performance.

Speed: 80 rpm

Operates at a speed of 80 rpm, suitable for applications requiring precise and controlled rotation.

No. of I/O Lines: 69

Abundant I/O lines for interfacing with external devices and sensors, enabling versatile input/output configurations.

Technical Specifications

Microcontrollers TM4C1237E6PZI attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

69

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Trade Compliance

TM4C1237E6PZI Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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