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TM4C1236H6PMIR

Texas Instruments

TM4C1236H6PMIR by Texas Instruments

TM4C1236H6PMIR by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. It features 12-Ch 12-Bit ADC channels, CAN, USB connectivity, and operates at a max clock frequency of 25 MHz. Ideal for industrial applications requiring high-speed data processing and multiple I/O lines.

Median Price

$8.578

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,311 parts In-Stock

1+ parts

$8.578

100+ parts

$6.993

1k+ parts

$4.662

10k+ parts

-

3,311

$8.578

$6.993

$4.662

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,423 parts In-Stock

1+ parts

$8.149

100+ parts

-

1k+ parts

-

10k+ parts

-

3,423

$8.149

-

-

-

Vyrian

USA . 6,412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,412

-

-

-

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Technoshack Inc.

Canada . 65 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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65

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 173 parts In-Stock

1+ parts

$7.720

100+ parts

-

1k+ parts

-

10k+ parts

-

173

$7.720

-

-

-

AZTECH Wire

Italy . 673 parts In-Stock

1+ parts

$15.310

100+ parts

-

1k+ parts

-

10k+ parts

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673

$15.310

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-

-

Microchip USA

USA . 2,727 parts In-Stock

1+ parts

$18.500

100+ parts

$18.240

1k+ parts

$18.110

10k+ parts

$17.970

2,727

$18.500

$18.240

$18.110

$17.970

Parana Technologies

USA . 203 parts In-Stock

1+ parts

$30.369

100+ parts

-

1k+ parts

$69.045

10k+ parts

-

203

$30.369

-

$69.045

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DigiPath Technology Company

USA . 1,045 parts In-Stock

1+ parts

$33.440

100+ parts

-

1k+ parts

-

10k+ parts

-

1,045

$33.440

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-

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ChromeModa Solutions

Germany . 5,025 parts In-Stock

1+ parts

$34.122

100+ parts

$27.980

1k+ parts

-

10k+ parts

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5,025

$34.122

$27.980

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IDEA Electronic Components Group

UK . 1,247 parts In-Stock

1+ parts

$34.122

100+ parts

$32.416

1k+ parts

$30.710

10k+ parts

-

1,247

$34.122

$32.416

$30.710

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Overview

Unlock new possibilities with the TM4C1236H6PMIR microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability. This powerful microcontroller is versatile, offering a wide range of applications in various industries. From robotics to IoT devices, the TM4C1236H6PMIR provides unmatched value with its advanced features and performance. Experience seamless connectivity, efficient power management, and exceptional processing speed with this innovative product. Stay ahead of the curve and elevate your projects with the TM4C1236H6PMIR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and secure installation of the microcontroller on a PCB, saving space and reducing assembly time.

Maximum Supply Voltage: 1.32 V

The low maximum supply voltage helps in minimizing power consumption and ensures safe operation of the microcontroller.

Bit Size: 32

A 32-bit architecture provides higher processing capability and performance for the microcontroller, making it suitable for complex applications.

Power Supplies (V): 1.2,3.3

Having multiple power supply options allows flexibility in design and compatibility with various power sources.

No. of Terminals: 64

With a high number of terminals, there are plenty of I/O options available for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package styles offer versatility in mounting options and compatibility with different PCB designs.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to perform reliably in harsh environmental conditions.

Data EEPROM Size: 2K

A larger EEPROM size allows for storing more data persistently, enhancing the functionality and versatility of the microcontroller.

ROM Programmability: FLASH

Flash ROM allows for easy and quick reprogramming of the microcontroller, enabling updates and modifications to the firmware.

Technical Specifications

Microcontrollers TM4C1236H6PMIR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C1236H6PMIR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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