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TM4C1233E6PZIR

Texas Instruments

TM4C1233E6PZIR by Texas Instruments

TM4C1233E6PZIR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 22-Ch 12-Bit ADC channels, 32 DMA channels, and 131072 ROM words. Ideal for industrial applications requiring high-speed processing, it supports various connectivity options like CAN, I2C(6), SPI, and USB.

Median Price

$8.473

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 24,546 parts In-Stock

1+ parts

$8.473

100+ parts

$6.908

1k+ parts

$4.605

10k+ parts

-

24,546

$8.473

$6.908

$4.605

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 799 parts In-Stock

1+ parts

$8.049

100+ parts

-

1k+ parts

-

10k+ parts

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799

$8.049

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Vyrian

USA . 4,263 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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4,263

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Chip Stock

USA . 3,300 parts In-Stock

1+ parts

-

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3,300

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TME

Poland . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.640

10k+ parts

-

3,000

-

-

$7.640

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,648 parts In-Stock

1+ parts

$7.626

100+ parts

-

1k+ parts

-

10k+ parts

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3,648

$7.626

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-

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Microchip USA

USA . 3,016 parts In-Stock

1+ parts

$17.580

100+ parts

$17.330

1k+ parts

$17.200

10k+ parts

$17.080

3,016

$17.580

$17.330

$17.200

$17.080

AZTECH Wire

Italy . 433 parts In-Stock

1+ parts

$18.670

100+ parts

-

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433

$18.670

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Parana Technologies

USA . 1,370 parts In-Stock

1+ parts

$48.586

100+ parts

-

1k+ parts

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10k+ parts

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1,370

$48.586

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ChromeModa Solutions

Germany . 5,091 parts In-Stock

1+ parts

$54.591

100+ parts

$44.765

1k+ parts

-

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5,091

$54.591

$44.765

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IDEA Electronic Components Group

UK . 2,107 parts In-Stock

1+ parts

$54.591

100+ parts

$51.861

1k+ parts

$49.132

10k+ parts

-

2,107

$54.591

$51.861

$49.132

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DigiPath Technology Company

USA . 1,873 parts In-Stock

1+ parts

-

100+ parts

$49.219

1k+ parts

-

10k+ parts

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1,873

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$49.219

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Overview

Unlock the power of innovation with the TM4C1233E6PZIR by Texas Instruments, a cutting-edge microcontroller designed to elevate your projects to new heights. Crafted by a trusted industry leader, this device boasts unrivaled quality and reliability. Perfect for a wide range of applications, from robotics to IoT devices, this microcontroller offers unmatched value and versatility. Experience seamless connectivity, advanced features, and superior performance all in one compact package. Take your projects to the next level with the TM4C1233E6PZIR and unleash endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 1.32 V

Allows for a higher supply voltage which can offer better performance and flexibility in different applications.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family is known for its high performance and efficiency, making this microcontroller suitable for demanding tasks.

ADC Channels: YES

Having Analog to Digital Convertor channels allows the microcontroller to interface with analog sensors or signals, expanding its functionality.

ROM Words: 131072

A larger ROM size enables storage of more program instructions, increasing the versatility of the microcontroller.

RAM Bytes: 32768

A generous amount of RAM allows for efficient data processing and multitasking capabilities.

Connectivity: CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

The wide range of connectivity options ensures compatibility with various communication protocols and devices, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers TM4C1233E6PZIR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

69

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Trade Compliance

TM4C1233E6PZIR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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