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TM4C1233E6PZI7R

Texas Instruments

TM4C1233E6PZI7R by Texas Instruments

TM4C1233E6PZI7R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, 131072 ROM words, and 22-Ch 12-Bit ADC channels. Ideal for industrial applications, it features low power mode, 80 rpm speed, and connectivity options like CAN, I2C, SPI.

Median Price

$8.473

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,995 parts In-Stock

1+ parts

$8.473

100+ parts

$6.908

1k+ parts

$4.605

10k+ parts

-

22,995

$8.473

$6.908

$4.605

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,846 parts In-Stock

1+ parts

$8.049

100+ parts

-

1k+ parts

-

10k+ parts

-

1,846

$8.049

-

-

-

Vyrian

USA . 3,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,660

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,559 parts In-Stock

1+ parts

$7.626

100+ parts

-

1k+ parts

-

10k+ parts

-

4,559

$7.626

-

-

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AZTECH Wire

Italy . 1,066 parts In-Stock

1+ parts

$9.480

100+ parts

-

1k+ parts

-

10k+ parts

-

1,066

$9.480

-

-

-

Microchip USA

USA . 1,948 parts In-Stock

1+ parts

$17.920

100+ parts

$17.660

1k+ parts

$17.530

10k+ parts

$17.400

1,948

$17.920

$17.660

$17.530

$17.400

Parana Technologies

USA . 308 parts In-Stock

1+ parts

$58.587

100+ parts

-

1k+ parts

-

10k+ parts

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308

$58.587

-

-

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DigiPath Technology Company

USA . 1,773 parts In-Stock

1+ parts

$64.511

100+ parts

-

1k+ parts

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10k+ parts

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1,773

$64.511

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ChromeModa Solutions

Germany . 1,269 parts In-Stock

1+ parts

$65.828

100+ parts

$53.979

1k+ parts

-

10k+ parts

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1,269

$65.828

$53.979

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IDEA Electronic Components Group

UK . 328 parts In-Stock

1+ parts

$65.828

100+ parts

$62.537

1k+ parts

$59.245

10k+ parts

-

328

$65.828

$62.537

$59.245

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QUARKTWIN TECHNOLOGY LTD

USA . 23,489 parts In-Stock

1+ parts

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100+ parts

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23,489

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Overview

Enhance your projects with the TM4C1233E6PZI7R microcontroller by Texas Instruments. Trusted for its high-quality products, Texas Instruments offers a reliable solution for various applications in the microcontroller category. With integrated cache and a wide range of peripherals, this microcontroller delivers exceptional value, performance, and flexibility to customers. Benefit from its low power mode, numerous I/O lines, and advanced connectivity options, making it an ideal choice for industrial-grade projects. Upgrade your designs with the Texas Instruments TM4C1233E6PZI7R and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and mechanical protection to the microcontroller, ensuring its longevity in various environments.

Integrated Cache: YES

The integrated cache enhances the processing speed and efficiency of the microcontroller, making it suitable for high-performance applications.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for flexibility in power supply configurations and supports a wider range of peripherals.

On Chip Data RAM Width: 8

The wider data RAM width enables faster data processing and manipulation within the microcontroller.

Package Shape: SQUARE

The square package shape offers efficient use of space and easy mounting onto circuit boards.

Bit Size: 32

The 32-bit architecture provides enhanced computational capabilities and precision in data processing.

No. of Terminals: 100

Having 100 terminals allows for a wide range of connectivity options and expansion possibilities for peripherals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications with demanding environmental conditions.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family is known for its high performance and energy efficiency, making it ideal for power-sensitive applications.

ADC Channels: YES

The presence of ADC channels enables analog signal processing, making this microcontroller versatile for a wide range of sensor-based applications.

Technical Specifications

Microcontrollers TM4C1233E6PZI7R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

69

No. of Serial I/Os:

20

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Trade Compliance

TM4C1233E6PZI7R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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