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TM4C1233C3PMI7R

Texas Instruments

TM4C1233C3PMI7R by Texas Instruments

TM4C1233C3PMI7R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, 12 ADC channels, and 32 DMA channels. It features a max clock frequency of 25 MHz and is ideal for industrial applications requiring low power consumption and high-speed data processing.

Median Price

$7.700

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 950 parts In-Stock

1+ parts

$7.700

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950

$7.700

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,371 parts In-Stock

1+ parts

$7.315

100+ parts

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2,371

$7.315

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Vyrian

USA . 5,444 parts In-Stock

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5,444

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,190 parts In-Stock

1+ parts

$6.930

100+ parts

-

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1,190

$6.930

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Microchip USA

USA . 3,040 parts In-Stock

1+ parts

$16.290

100+ parts

$16.060

1k+ parts

$15.940

10k+ parts

$15.820

3,040

$16.290

$16.060

$15.940

$15.820

AZTECH Wire

Italy . 601 parts In-Stock

1+ parts

$17.620

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601

$17.620

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Parana Technologies

USA . 1,984 parts In-Stock

1+ parts

$35.647

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1,984

$35.647

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DigiPath Technology Company

USA . 1,190 parts In-Stock

1+ parts

$39.252

100+ parts

$36.112

1k+ parts

-

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1,190

$39.252

$36.112

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ChromeModa Solutions

Germany . 3,275 parts In-Stock

1+ parts

$40.053

100+ parts

$32.843

1k+ parts

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3,275

$40.053

$32.843

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IDEA Electronic Components Group

UK . 713 parts In-Stock

1+ parts

$40.053

100+ parts

$38.050

1k+ parts

$36.048

10k+ parts

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713

$40.053

$38.050

$36.048

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Overview

Unleash the power of innovation with the TM4C1233C3PMI7R by Texas Instruments, a top-tier microcontroller designed to elevate your projects to new heights. Crafted with precision and expertise, this device offers seamless integration, advanced features, and unmatched reliability. Perfect for a wide range of applications, from robotics to IoT devices, this cutting-edge product ensures optimal performance and efficiency. Experience the superior quality and value that only Texas Instruments can provide, and unlock endless possibilities with the TM4C1233C3PMI7R. Elevate your creations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Integrated Cache: YES

The integrated cache improves processing speed and efficiency, enhancing the overall performance of the microcontroller.

Maximum Supply Voltage: 1.32 V

This higher supply voltage allows for greater flexibility in power requirements for the microcontroller.

On Chip Data RAM Width: 8

Having a wider data RAM width enables faster data transfer and processing within the microcontroller.

RAM Words: 32

Having a sufficient amount of RAM words allows for storage and manipulation of data during operation.

Technical Specifications

Microcontrollers TM4C1233C3PMI7R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

43

No. of Serial I/Os:

7

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

12288

RAM Words:

32

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(4), MICROWIRE, QEI(2), SPI, SSI(4), UART(8), USB

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(32), POR, PWM(8), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C1233C3PMI7R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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