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TM4C1232E6PMI7

Texas Instruments

TM4C1232E6PMI7 by Texas Instruments

TM4C1232E6PMI7 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 131072 ROM words, and 24 RAM words. It features 12 ADC channels, 32 DMA channels, and peripherals like PWM and RTC. Ideal for industrial applications requiring low power consumption and high-speed processing up to 25 MHz.

Median Price

$8.970

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,230 parts In-Stock

1+ parts

$8.970

100+ parts

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8,230

$8.970

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 715 parts In-Stock

1+ parts

$8.522

100+ parts

-

1k+ parts

-

10k+ parts

-

715

$8.522

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Vyrian

USA . 7,486 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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7,486

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,699 parts In-Stock

1+ parts

$8.073

100+ parts

-

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-

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2,699

$8.073

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AZTECH Wire

Italy . 48 parts In-Stock

1+ parts

$19.920

100+ parts

-

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48

$19.920

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Parana Technologies

USA . 32 parts In-Stock

1+ parts

$24.235

100+ parts

-

1k+ parts

$24.894

10k+ parts

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32

$24.235

-

$24.894

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Microchip USA

USA . 1,621 parts In-Stock

1+ parts

$25.510

100+ parts

$25.150

1k+ parts

$24.970

10k+ parts

$24.780

1,621

$25.510

$25.150

$24.970

$24.780

DigiPath Technology Company

USA . 1,299 parts In-Stock

1+ parts

$26.685

100+ parts

$24.551

1k+ parts

-

10k+ parts

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1,299

$26.685

$24.551

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ChromeModa Solutions

Germany . 6,162 parts In-Stock

1+ parts

$27.230

100+ parts

$22.329

1k+ parts

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6,162

$27.230

$22.329

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IDEA Electronic Components Group

UK . 149 parts In-Stock

1+ parts

$27.230

100+ parts

$25.868

1k+ parts

$24.507

10k+ parts

-

149

$27.230

$25.868

$24.507

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Component Stockers USA

USA . 243 parts In-Stock

1+ parts

$143.550

100+ parts

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243

$143.550

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Overview

Unlock the power of innovation with the TM4C1232E6PMI7 by Texas Instruments, a cutting-edge microcontroller designed to revolutionize your projects. Crafted with precision and expertise, this device boasts integrated cache, advanced ADC channels, and superb connectivity options, making it perfect for a wide range of applications. Whether you're a seasoned professional or a hobbyist, this microcontroller offers unparalleled value, efficiency, and performance. Experience seamless operation and endless possibilities with the TM4C1232E6PMI7, your gateway to limitless creativity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for various applications without adding unnecessary weight or cost.

Integrated Cache: YES

The integrated cache helps improve the overall performance of the microcontroller by reducing access times to frequently used data and instructions.

Maximum Supply Voltage: 1.32 V

This low maximum supply voltage ensures energy efficiency and helps in reducing power consumption, making it suitable for battery-powered applications.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and easy integration into compact designs.

Bit Size: 32

A 32-bit architecture allows for higher processing speeds, enhanced performance, and support for complex algorithms and calculations.

ROM Words: 131072

With a large ROM capacity, the microcontroller can store a significant amount of program data, making it suitable for applications that require extensive code storage.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial automation and control applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency allows for fast processing speeds and real-time performance, making the microcontroller suitable for applications that require quick response times.

Connectivity: CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

The multiple connectivity options provide flexibility in communication interfaces, allowing the microcontroller to easily interface with various other devices and peripherals.

Technical Specifications

Microcontrollers TM4C1232E6PMI7 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

49

No. of Serial I/Os:

5

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

24

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C1232E6PMI7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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