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TM4C1231H6PGEIR

Texas Instruments

TM4C1231H6PGEIR by Texas Instruments

TM4C1231H6PGEIR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 144 terminals, 262144 ROM words, and 32768 RAM bytes. Ideal for industrial applications, it offers peripherals like PWM, RTC, and UART connectivity at a max clock frequency of 25 MHz.

Median Price

$7.695

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,485 parts In-Stock

1+ parts

$7.695

100+ parts

$6.273

1k+ parts

$4.182

10k+ parts

-

8,485

$7.695

$6.273

$4.182

-

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$6.690

1k+ parts

$5.980

10k+ parts

$5.630

500

-

$6.690

$5.980

$5.630

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$8.363

1k+ parts

$7.475

10k+ parts

$7.037

500

-

$8.363

$7.475

$7.037

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 144 parts In-Stock

1+ parts

$5.928

100+ parts

-

1k+ parts

-

10k+ parts

-

144

$5.928

-

-

-

Chip Stock

USA . 6,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,990

-

-

-

-

Vyrian

USA . 5,504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,504

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,394 parts In-Stock

1+ parts

$5.616

100+ parts

-

1k+ parts

-

10k+ parts

-

1,394

$5.616

-

-

-

AZTECH Wire

Italy . 536 parts In-Stock

1+ parts

$13.020

100+ parts

-

1k+ parts

-

10k+ parts

-

536

$13.020

-

-

-

Parana Technologies

USA . 760 parts In-Stock

1+ parts

$34.421

100+ parts

-

1k+ parts

-

10k+ parts

-

760

$34.421

-

-

-

DigiPath Technology Company

USA . 40 parts In-Stock

1+ parts

$37.902

100+ parts

$34.869

1k+ parts

-

10k+ parts

-

40

$37.902

$34.869

-

-

ChromeModa Solutions

Germany . 3,044 parts In-Stock

1+ parts

$38.675

100+ parts

$31.714

1k+ parts

-

10k+ parts

-

3,044

$38.675

$31.714

-

-

IDEA Electronic Components Group

UK . 1,206 parts In-Stock

1+ parts

$38.675

100+ parts

$36.741

1k+ parts

$34.808

10k+ parts

-

1,206

$38.675

$36.741

$34.808

-

Overview

Unlock the power of innovation with the TM4C1231H6PGEIR microcontroller from Texas Instruments. Built with precision and expertise, this device offers unmatched performance in a variety of applications. With cutting-edge technology and a robust design, Texas Instruments delivers reliability and quality in every product. Whether you're working on industrial automation, consumer electronics, or automotive systems, this microcontroller provides the flexibility and efficiency you need to bring your ideas to life. Experience the benefits of seamless connectivity, high-speed processing, and advanced features that set this device apart from the rest. Choose Texas Instruments for excellence in microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring its longevity.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto a circuit board.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options for the microcontroller.

Package Shape: SQUARE

The square shape helps in easy placement of the microcontroller on the PCB, optimizing space usage.

Bit Size: 32

A 32-bit microcontroller provides enhanced processing power and efficiency for complex tasks and calculations.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for compatibility with various power sources and configurations.

No. of Terminals: 144

A higher number of terminals enables connectivity to a wide range of external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style options offer flexibility in mounting and integration of the microcontroller into different devices and applications.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage ensures efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the microcontroller to operate reliably in various environmental conditions.

CPU Family: CORTEX-M4F

The Cortex-M4F architecture offers high performance and efficiency for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish offers high conductivity and durability for reliable connections and signal transmission.

ADC Channels: YES

Having Analog to Digital Converter channels enables the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency and speed for improved performance.

Terminal Position: QUAD

The quad terminal position provides stable and secure mounting of the microcontroller on the PCB.

ROM Words: 262144

The large ROM size allows for ample storage of program code and data, catering to extensive applications.

Maximum Seated Height: 1.6 mm

The low profile design with maximum seated height saves space and allows for compact device designs.

Width: 20 mm

The compact width facilitates easy integration of the microcontroller into various electronic devices.

Data EEPROM Size: 2K

Having EEPROM data storage allows for non-volatile memory to store critical data and program parameters.

Peripherals: BOD, COMPARATOR(3), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

A wide range of peripherals provides enhanced functionality and connectivity options for diverse applications.

Maximum Clock Frequency: 25 MHz

The high clock frequency enables fast processing and execution of instructions for efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures stable and robust solder joints during assembly.

Length: 20 mm

The compact length of the microcontroller allows for space-saving and efficient integration into electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller provides efficient and streamlined execution of instructions.

RAM Bytes: 32768

The large RAM size enables temporary data storage and efficient multitasking for complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure connections on the PCB.

Analog To Digital Convertors: 24-Ch 12-Bit

24-channel 12-bit ADCs provide high-resolution analog input conversion for precise measurements and sensor interfacing.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures stable and efficient operation of the microcontroller.

Connectivity: CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8)

The variety of connectivity options enable seamless communication with other devices and peripherals.

ROM Programmability: FLASH

Having flash ROM allows for easy reprogramming and updating of firmware and software in the microcontroller.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and compact PCB designs with multiple components.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller has moderate sensitivity to moisture during storage and handling.

Speed: 80 rpm

The speed specification may refer to the processing speed or other operational parameters of the microcontroller, ensuring efficient performance.

On Chip Program ROM Width: 8

The 8-bit on-chip program ROM width ensures efficient processing and execution of program instructions.

No. of I/O Lines: 105

Having a high number of I/O lines enables versatile interfacing with external devices and peripherals, enhancing the microcontroller's functionality.

Technical Specifications

Microcontrollers TM4C1231H6PGEIR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

105

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8)

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C1231H6PGEIR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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