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TM4C1231H6PGEI

Texas Instruments

TM4C1231H6PGEI by Texas Instruments

TM4C1231H6PGEI by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 144 terminals, 32768 bytes of RAM, and 262144 ROM words. Ideal for industrial applications, it offers peripherals like BOD, DMA(32), PWM, and UART(8) along with connectivity options such as CAN and SPI.

Median Price

$6.586

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

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$2.244

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1

$2.244

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Rochester

USA . 645 parts In-Stock

1+ parts

$4.960

100+ parts

$4.860

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$4.760

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645

$4.960

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$4.760

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Verical

USA . 1 parts In-Stock

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$6.586

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$6.586

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Chip1Stop

Japan . 1 parts In-Stock

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$7.040

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$7.040

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Texas Instruments

USA . 9,391 parts In-Stock

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$8.850

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$7.215

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$4.810

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9,391

$8.850

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$4.810

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Distributors (In-Stock)

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Digiode

USA . 3,960 parts In-Stock

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$4.196

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3,960

$4.196

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Chip Stock

USA . 6,386 parts In-Stock

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Vyrian

USA . 3,078 parts In-Stock

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TME

Poland . 60 parts In-Stock

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$10.155

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$10.155

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Distributors (Availability)

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Semicontronic

India . 1,874 parts In-Stock

1+ parts

$3.750

100+ parts

$3.656

1k+ parts

$3.638

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1,874

$3.750

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$3.638

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Ampacity Inc.

Singapore . 1,686 parts In-Stock

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$3.750

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Corphita

USA . 2,737 parts In-Stock

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$3.975

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Continental Prestige Electronics

USA . 4,703 parts In-Stock

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$10.274

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$10.069

4,703

$10.274

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$10.069

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$11.815

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$11.579

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$11.815

$11.579

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AZTECH Wire

Italy . 521 parts In-Stock

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$12.370

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Microchip USA

USA . 1,097 parts In-Stock

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$28.990

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$28.580

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$28.370

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$28.160

1,097

$28.990

$28.580

$28.370

$28.160

Corohmni

South Africa . 455 parts In-Stock

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$36.327

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455

$36.327

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Parana Technologies

USA . 622 parts In-Stock

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$50.301

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$4,671.213

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$45.271

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622

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$45.271

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DigiPath Technology Company

USA . 353 parts In-Stock

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$55.388

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$50.957

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ChromeModa Solutions

Germany . 2,867 parts In-Stock

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$56.518

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$46.345

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IDEA Electronic Components Group

UK . 537 parts In-Stock

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$56.518

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$53.692

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$50.866

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537

$56.518

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$50.866

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A-Z Elektronik GmbH

Germany . 7,758 parts In-Stock

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Futuretech Components

Singapore . 960 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Robosynatics

Brazil . 100 parts In-Stock

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$2.267

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Lucentia Tech

USA . 100 parts In-Stock

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$2.267

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$2.267

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Overview

Unlock endless possibilities with the TM4C1231H6PGEI microcontroller from Texas Instruments. Crafted with precision and reliability, this powerful device boasts a wide range of applications in various industries. Experience seamless connectivity with features like ADC channels, DMA channels, and peripherals including PWM and RTC. With its advanced technology and high-quality components, this microcontroller offers unparalleled performance and efficiency. Elevate your projects to new heights with the TM4C1231H6PGEI and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring its longevity.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the microcontroller onto circuit boards.

Maximum Supply Voltage: 1.32 V

Can operate efficiently at a relatively low maximum supply voltage, making it energy-efficient.

Package Shape: SQUARE

Square package shape allows for easier mounting and efficient use of PCB space.

Bit Size: 32

32-bit architecture enables processing of more complex tasks and data with higher accuracy.

Power Supplies (V): 1.2,3.3

Supports a wide range of power supply voltages, increasing compatibility with different systems.

No. of Terminals: 144

Higher number of terminals provide more connectivity options, increasing flexibility in system design.

ADC Channels: YES

Presence of Analog to Digital Converter channels enables precise analog signal measurement and processing.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer between peripherals without CPU intervention, improving overall system performance.

Connectivity: CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8)

Multiple connectivity options provide versatility in communication protocols for interfacing with various devices.

Technical Specifications

Microcontrollers TM4C1231H6PGEI attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

105

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8)

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C1231H6PGEI Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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