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TM4C1231D5PMT7R

Texas Instruments

TM4C1231D5PMT7R by Texas Instruments

TM4C1231D5PMT7R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, 12 ADC channels, and 32 DMA channels. It operates at a max clock frequency of 25 MHz and features low power mode for industrial applications. With integrated cache and on-chip data RAM width of 8, it offers high performance in a compact square package style.

Median Price

$6.479

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,072 parts In-Stock

1+ parts

$6.479

100+ parts

$5.282

1k+ parts

$3.521

10k+ parts

-

2,072

$6.479

$5.282

$3.521

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,802 parts In-Stock

1+ parts

$6.155

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-

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1,802

$6.155

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Vyrian

USA . 7,762 parts In-Stock

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7,762

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Distributors (Availability)

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Corphita

USA . 2,772 parts In-Stock

1+ parts

$5.831

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-

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2,772

$5.831

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AZTECH Wire

Italy . 116 parts In-Stock

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$17.600

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116

$17.600

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Microchip USA

USA . 2,377 parts In-Stock

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$31.210

100+ parts

$31.010

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$30.920

10k+ parts

$30.820

2,377

$31.210

$31.010

$30.920

$30.820

Parana Technologies

USA . 1,291 parts In-Stock

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$40.990

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1,291

$40.990

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DigiPath Technology Company

USA . 642 parts In-Stock

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$45.135

100+ parts

$41.524

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642

$45.135

$41.524

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ChromeModa Solutions

Germany . 5,180 parts In-Stock

1+ parts

$46.056

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$37.766

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5,180

$46.056

$37.766

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IDEA Electronic Components Group

UK . 1,444 parts In-Stock

1+ parts

$46.056

100+ parts

$43.753

1k+ parts

$41.450

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1,444

$46.056

$43.753

$41.450

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Component Stockers USA

USA . 693 parts In-Stock

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$66.570

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693

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QUARKTWIN TECHNOLOGY LTD

USA . 19,597 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,343 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Lixinc

USA . 1,457 parts In-Stock

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Metaverse IC Inc.

Canada . 600 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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500

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Overview

Unlock the power of cutting-edge technology with the TM4C1231D5PMT7R microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that are designed to excel in a variety of applications. This microcontroller offers unparalleled performance and reliability, making it the perfect choice for your next project. With integrated cache, advanced peripherals, and low power mode, this microcontroller provides exceptional value and benefits to customers looking to streamline their designs and enhance overall efficiency. Trust in Texas Instruments for innovative solutions that drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and thermal performance, making the product suitable for harsh operating environments.

Integrated Cache: YES

Integrated cache improves processing speed and efficiency, enhancing overall performance of the microcontroller.

Maximum Supply Voltage: 3.63 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with various applications.

On Chip Data RAM Width: 8

Wider data RAM width enables faster data processing and storage capabilities within the microcontroller.

Package Shape: SQUARE

Square package shape offers efficient use of board space and easy integration into electronic devices.

Bit Size: 32

32-bit architecture enables higher processing speeds and performance capabilities compared to lower bit sizes.

No. of Terminals: 64

Increased number of terminals allow for more connectivity options and interfaces, enhancing versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style offers space-saving design and easy assembly onto circuit boards.

Minimum Supply Voltage: 3.15 V

Lower minimum supply voltage ensures efficient power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature range allows for reliable performance in extreme temperature conditions.

CPU Family: CORTEX-M4F

Cortex-M4F CPU family is known for its high performance and energy efficiency, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables reliable performance in cold environments without risk of malfunction.

ADC Channels: YES

Analog to Digital Converters (ADC) channels allow for accurate conversion of analog signals to digital data, essential for sensor interfacing and data acquisition.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer speed and efficiency, optimizing system performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers excellent conductivity and corrosion resistance for reliable connections.

ROM Words: 65536

Large ROM size provides ample space for program storage, allowing for complex applications to be implemented on the microcontroller.

Maximum Seated Height: 1.6 mm

Low seated height facilitates compact design and enables integration into thin electronic devices or tight spaces.

RAM Words: 24

Sufficient RAM word capacity enables efficient data processing and manipulation, improving overall system performance.

Width: 10 mm

Compact width dimension allows for easy integration into small form factor devices without compromising on functionality.

Data EEPROM Size: 2048

Sizeable EEPROM capacity enables non-volatile data storage for critical information, ensuring data retention even during power loss.

Boundary Scan: YES

Boundary scan feature provides testing and debugging capabilities for efficient verification of circuit connections and signal integrity.

Peripherals: DMA(32), TIMER(12), WDT

Rich set of peripherals such as DMA, timers, and watchdog timer enhance system functionality and performance in various applications.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for fast execution of instructions and high-speed operation, making the microcontroller suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and reliability during assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for lead-free soldering and complies with RoHS requirements for environmental safety.

Length: 10 mm

Compact length dimension offers flexibility in design and placement within electronic devices, saving valuable board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments with wide temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture offers high performance and power efficiency for demanding applications.

No. of Timers: 12

Abundance of timer peripherals allows for precise timing control and scheduling in various applications, enhancing system functionality.

RAM Bytes: 24576

Large RAM capacity in bytes provides ample storage for temporary data, improving system responsiveness and multitasking capabilities.

Technology: CMOS

Complementary Metal-Oxide Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form allows for easy surface mounting onto circuit boards, improving manufacturing efficiency and reliability of connections.

Analog To Digital Convertors: 12-Ch 12-Bit

Multiple channels and high bit resolution of the ADCs enable accurate conversion of analog signals for precise measurement and control applications.

Maximum Supply Current: 58.7 mA

Low maximum supply current consumption ensures energy efficiency and extends battery life in portable and battery-powered devices.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller in various voltage conditions.

No. of DMA Channels: 32

Abundance of DMA channels allows for efficient data transfer and processing without CPU intervention, improving overall system performance.

No. of Serial I/Os: 17

Multiple serial I/O interfaces provide versatile communication options for connecting to external devices and peripherals, enhancing system connectivity.

Connectivity: CAN, I2C(4), SSI(4), UART(8)

Diverse connectivity options such as CAN, I2C, SSI, and UART interfaces support a wide range of communication protocols for seamless integration with external devices.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible program updates, enabling quick software modifications and enhancements.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables precise connection to circuit boards with high-density layout, ensuring secure and reliable soldering.

Format: FLOATING POINT

Floating point format supports high-precision mathematical calculations, essential for scientific, engineering, and data processing applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, allowing for safe and reliable storage and handling of the microcontroller during assembly.

Speed: 80 rpm

High-speed operation at 80 revolutions per minute ensures efficient processing and execution of instructions, enhancing overall system performance.

Low Power Mode: YES

Low power mode functionality allows for energy-efficient operation and extends battery life, ideal for power-sensitive applications and portable devices.

On Chip Program ROM Width: 8

Wider on-chip program ROM width enables storage of larger program code, supporting complex algorithms and applications on the microcontroller.

No. of I/O Lines: 43

Abundance of I/O lines provides ample connectivity options for interfacing with external devices and peripherals, enhancing system versatility and functionality.

Technical Specifications

Microcontrollers TM4C1231D5PMT7R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

43

No. of Serial I/Os:

17

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

24576

RAM Words:

24

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

58.7 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

CAN, I2C(4), SSI(4), UART(8)

Peripherals:

DMA(32), TIMER(12), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C1231D5PMT7R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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