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TLV320AIC12KEVMB-K

Texas Instruments

TLV320AIC12KEVMB-K by Texas Instruments

TLV320AIC12KEVMB-K by Texas Instruments is an Audio CODEC with Mono, 16-Bit, 26-KSPS capabilities. It is used in Development Boards for Evaluation and Demonstration purposes. The package includes the board(s) and it falls under the TLV320 product line.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,492 parts In-Stock

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Digiode

USA . 3,030 parts In-Stock

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3,030

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Distributors (Availability)

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AZTECH Wire

Italy . 423 parts In-Stock

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$6.893

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423

$6.893

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Semicontronic

India . 559 parts In-Stock

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$119.100

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$116.122

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$115.527

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559

$119.100

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$115.527

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One Stop Electronics

USA . 382 parts In-Stock

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$218.100

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382

$218.100

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ChromeModa Solutions

Germany . 2,892 parts In-Stock

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2,892

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DigiPath Technology Company

USA . 2,262 parts In-Stock

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2,262

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Parana Technologies

USA . 2,071 parts In-Stock

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$1.157

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2,071

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$1.157

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Corphita

USA . 1,320 parts In-Stock

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1,320

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IDEA Electronic Components Group

UK . 1,218 parts In-Stock

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Corohmni

South Africa . 211 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Experience high-quality audio performance with the TLV320AIC12KEVMB-K by Texas Instruments. This versatile audio codec evaluation board offers exceptional value and benefits for customers in need of reliable audio solutions. Whether you're working on a project that requires mono audio, 16-bit resolution, or 26-KSPS sampling rate, this board has got you covered. Perfect for development and demonstration purposes, the TLV320AIC12KEVMB-K is a must-have for anyone looking to enhance their audio experience.

Feature Benefit Bullets

Other Names: TLV320AIC12KEVMBK, 296-31031, TLV320AIC12KEVMB-K-ND

Having multiple names makes it easier to identify and order the product from different sources.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Evaluation and Demonstration Boards and Kits

This product falls under various categories, indicating its versatility and wide range of applications.

Package: Box

The product is securely stored and protected in a box packaging, ensuring safe transportation and storage.

Type: Audio

Designed specifically for audio applications, making it ideal for projects related to sound processing or playback.

Function: CODEC

Being a CODEC (coder-decoder) device, it can encode and decode digital signals, making it essential for audio processing and communication systems.

Utilized IC / Part: TLV320AIC12K

Utilizing a specific IC or part ensures compatibility and optimized performance within the product design.

Primary Attributes: Mono, 16-Bit, 26-KSPS

With a mono configuration, 16-bit resolution, and a sampling rate of 26 kilo-samples per second, this product offers high-quality audio processing capabilities.

Supplied Contents: Board(s)

The product comes with the necessary board(s) for evaluation and testing, providing convenience for users.

Base Product Number: TLV320

Being part of the TLV320 series, this product is backed by a reputable product line known for its quality and performance.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The product can withstand various levels of moisture exposure, ensuring durability and reliability in different environments.

Technical Specifications

Additional Parts TLV320AIC12KEVMB-K attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

TLV320AIC12KEVMBK
296-31031
TLV320AIC12KEVMB-K-ND

Function:

CODEC

Type:

Audio

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

TLV320AIC12K

Package:

Box

Embedded:

No

Primary Attributes:

Mono, 16-Bit, 26-KSPS

Standard Package:

1

Base Product Number:

TLV320

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TLV320AIC12KEVMB-K Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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