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TLV320ADC6120IRTER

Texas Instruments

TLV320ADC6120IRTER by Texas Instruments

TLV320ADC6120IRTER by Texas Instruments is a 32-bit ADC with 2 analog in channels. It operates b/w -40 to 125°C, ideal for automotive applications. With a sample rate of 0.768 MHz and output format as serial, it offers precise binary output in a compact chip carrier package.

Median Price

$4.802

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,294 parts In-Stock

1+ parts

$4.120

100+ parts

$2.594

1k+ parts

$2.318

10k+ parts

$2.238

1,294

$4.120

$2.594

$2.318

$2.238

Texas Instruments

USA . 63,957 parts In-Stock

1+ parts

$4.802

100+ parts

$4.207

1k+ parts

$2.377

10k+ parts

-

63,957

$4.802

$4.207

$2.377

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Mouser Electronics

USA . 2,982 parts In-Stock

1+ parts

$5.780

100+ parts

$3.260

1k+ parts

$2.530

10k+ parts

$2.140

2,982

$5.780

$3.260

$2.530

$2.140

Distributors (In-Stock)

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Digiode

USA . 2,376 parts In-Stock

1+ parts

$4.562

100+ parts

-

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2,376

$4.562

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Maritex

Poland . 2 parts In-Stock

1+ parts

$8.133

100+ parts

$4.958

1k+ parts

$3.947

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-

2

$8.133

$4.958

$3.947

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Vyrian

USA . 23,578 parts In-Stock

1+ parts

-

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23,578

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Chip Stock

USA . 4,882 parts In-Stock

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4,882

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Nova Conductors

Japan . 45 parts In-Stock

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45

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Distributors (Availability)

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Corphita

USA . 2,684 parts In-Stock

1+ parts

$4.322

100+ parts

-

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2,684

$4.322

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Parana Technologies

USA . 2,158 parts In-Stock

1+ parts

$6.277

100+ parts

-

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$7.030

10k+ parts

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2,158

$6.277

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$7.030

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DigiPath Technology Company

USA . 464 parts In-Stock

1+ parts

$6.912

100+ parts

-

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464

$6.912

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ChromeModa Solutions

Germany . 3,869 parts In-Stock

1+ parts

$7.053

100+ parts

$5.783

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3,869

$7.053

$5.783

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IDEA Electronic Components Group

UK . 174 parts In-Stock

1+ parts

$7.053

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$6.348

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174

$7.053

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$6.348

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Ampacity Inc.

Singapore . 23,415 parts In-Stock

1+ parts

$8.880

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$8.880

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Corohmni

South Africa . 442 parts In-Stock

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$19.753

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442

$19.753

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Lixinc

USA . 17,812 parts In-Stock

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Argo Parts USA

USA . 5,374 parts In-Stock

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5,374

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Continental Prestige Electronics

USA . 222 parts In-Stock

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222

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Discover the unparalleled precision and reliability of the TLV320ADC6120IRTER by Texas Instruments, a leading manufacturer in Analog-to-Digital Converters. This cutting-edge product boasts a variety of applications in automotive systems, industrial equipment, and more. With its high-quality construction and innovative features, customers can trust in the value and benefits this converter brings to their projects. Experience enhanced performance and accuracy with the TLV320ADC6120IRTER, setting new standards in analog-to-digital conversion technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material in the package body provides good durability and protection for the Analog-to-Digital Converter.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in connecting different input sources to the converter.

Surface Mount: YES

Being surface mountable makes it easier to integrate this ADC into various electronic circuit designs.

No. of Bits: 32

With a high resolution of 32 bits, this ADC can provide accurate and detailed conversion of analog signals.

No. of Terminals: 20

Having 20 terminals allows for easy connectivity and interfacing with other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style of CHIP CARRIER, HEAT SINK/SLUG, and VERY THIN PROFILE enables efficient heat dissipation and compact design.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this ADC can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of NICKEL PALLADIUM GOLD terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The QUAD terminal position simplifies the layout and routing of connections in the circuit.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8 mm makes this ADC suitable for compact electronic designs.

Width: 3 mm

The small width of 3 mm enables easy integration of this ADC into tight spaces or PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this ADC is easy to handle during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures the reliable soldering of this ADC onto the PCB.

Length: 3 mm

The compact length of 3 mm allows for space-saving integration of this ADC in electronic devices.

Temperature Grade: AUTOMOTIVE

The AUTOMOTIVE temperature grade indicates that this ADC is suitable for automotive applications requiring high reliability and performance.

Maximum Analog Input Voltage: 1.9 V

The high maximum analog input voltage of 1.9 V allows this ADC to handle a wide range of input signal levels.

Sample Rate: 0.768 MHz

The high sample rate of 0.768 MHz enables fast and efficient conversion of analog signals.

Terminal Form: NO LEAD

The NO LEAD terminal form is environmentally friendly and complies with lead-free manufacturing regulations.

Converter Type: ADC, DELTA-SIGMA

The use of DELTA-SIGMA converter technology ensures high accuracy and precision in signal conversion.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage of 1.8 V makes this ADC energy-efficient and suitable for battery-powered devices.

Output Bit Code: BINARY

The binary output bit code simplifies interfacing with digital systems and processing of the converted data.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting and space-efficient PCB design.

Minimum Analog Input Voltage: 0 V

The low minimum analog input voltage of 0 V ensures that even small signals can be accurately converted by this ADC.

Output Format: SERIAL

The serial output format allows for easy communication and integration with other digital components or microcontrollers.

Moisture Sensitivity Level (MSL): 2

The MSL level of 2 indicates that this ADC is moderately sensitive to moisture, making it suitable for a wide range of operating environments.

Technical Specifications

Analog-to-Digital Converters TLV320ADC6120IRTER attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

32

Output Bit Code:

Binary

Output Format:

Serial

Sample Rate:

768 kHz

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

1.9 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC20,.12SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Trade Compliance

TLV320ADC6120IRTER Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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