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TLV320ADC6140IRTWR

Texas Instruments

TLV320ADC6140IRTWR by Texas Instruments

TLV320ADC6140IRTWR by Texas Instruments is a 32-bit ADC with 4 analog in channels, 0.768 MHz sample rate, and 3.6 V max analog input voltage. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and serial output format.

Median Price

$5.272

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,052 parts In-Stock

1+ parts

$5.272

100+ parts

$4.620

1k+ parts

$2.610

10k+ parts

-

9,052

$5.272

$4.620

$2.610

-

DigiKey

USA . 1,701 parts In-Stock

1+ parts

$9.170

100+ parts

$6.065

1k+ parts

$5.505

10k+ parts

$3.571

1,701

$9.170

$6.065

$5.505

$3.571

Arrow

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.672

6,000

-

-

-

$3.672

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 704 parts In-Stock

1+ parts

$3.672

100+ parts

-

1k+ parts

-

10k+ parts

-

704

$3.672

-

-

-

Digiode

USA . 1,842 parts In-Stock

1+ parts

$5.008

100+ parts

-

1k+ parts

-

10k+ parts

-

1,842

$5.008

-

-

-

Cyclops Electronics Ltd

UK . 2,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,283

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 288 parts In-Stock

1+ parts

$4.745

100+ parts

-

1k+ parts

-

10k+ parts

-

288

$4.745

-

-

-

Parana Technologies

USA . 1,188 parts In-Stock

1+ parts

$4.901

100+ parts

-

1k+ parts

$5.432

10k+ parts

-

1,188

$4.901

-

$5.432

-

DigiPath Technology Company

USA . 1,130 parts In-Stock

1+ parts

$5.397

100+ parts

$4.965

1k+ parts

-

10k+ parts

-

1,130

$5.397

$4.965

-

-

IDEA Electronic Components Group

UK . 1,839 parts In-Stock

1+ parts

$5.507

100+ parts

-

1k+ parts

$4.956

10k+ parts

-

1,839

$5.507

-

$4.956

-

ChromeModa Solutions

Germany . 1,071 parts In-Stock

1+ parts

$5.507

100+ parts

$4.516

1k+ parts

-

10k+ parts

-

1,071

$5.507

$4.516

-

-

A-Z Elektronik GmbH

Germany . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,000

-

-

-

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,000

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-

-

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Lixinc

USA . 2,559 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,559

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-

-

-

Overview

Unlock the power of precision with the TLV320ADC6140IRTWR by Texas Instruments. As a leader in Analog-to-Digital Converters, Texas Instruments delivers unmatched quality and reliability in their products. Perfect for automotive applications, this 32-bit ADC offers exceptional performance with its 4 analog input channels and high sample rate. With a compact square package design and advanced features like a binary output format, this ADC provides customers with unparalleled value and accuracy for their projects. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability, making this product suitable for various environments and applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple signals to be converted simultaneously, increasing efficiency and performance.

Surface Mount: YES

Surface mount capability makes installation and integration into circuit boards easier and more efficient.

Package Shape: SQUARE

Square package shape provides a compact design that saves space and allows for easy mounting in tight spaces.

No. of Bits: 32

32 bits of resolution provide high precision and accuracy in converting analog signals to digital data.

No. of Terminals: 24

Having 24 terminals allows for versatile connection options and flexibility in application design.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer different thermal management options, ensuring stable performance under varying conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range makes this product suitable for industrial and automotive applications where heat resistance is crucial.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position offers stable and secure connections, reducing the risk of signal interference or loss.

Maximum Seated Height: 0.8 mm

Low maximum seated height allows for slim and compact designs, ideal for space-constrained applications.

Width: 4 mm

Compact width dimension enables easy integration and placement in circuit layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and efficient soldering process, saving time and reducing labor costs.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable and strong solder joints for long-term durability.

Length: 4 mm

Compact length dimension allows for versatile placement and integration into various PCB layouts.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures that the product can withstand harsh operating conditions in automotive environments.

Maximum Analog Input Voltage: 3.6 V

High maximum analog input voltage provides compatibility with a wide range of signal sources, increasing the product's versatility.

Sample Rate: 0.768 MHz

High sample rate allows for fast and accurate signal conversion, making this product suitable for high-speed applications.

Terminal Form: NO LEAD

No-lead terminal form offers eco-friendly and RoHS compliant design, meeting modern environmental standards.

Converter Type: ADC, DELTA-SIGMA

Delta-sigma ADC converter type provides high-resolution and low noise performance, ideal for precise analog-to-digital conversion.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the product.

Output Bit Code: BINARY

Binary output bit code simplifies data processing and analysis, making it easier to interface with other digital systems.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for compact and space-efficient PCB layout design, saving valuable board real estate.

Minimum Analog Input Voltage: 0 V

Low minimum analog input voltage allows for accurate signal detection even at low power levels.

Output Format: SERIAL

Serial output format provides easy data transmission and compatibility with various digital communication protocols.

Technical Specifications

Analog-to-Digital Converters TLV320ADC6140IRTWR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

32

Output Bit Code:

Binary

Output Format:

Serial

Sample Rate:

768 kHz

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

3.6 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.157 in (4 mm)

Length:

0.157 in (4 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Trade Compliance

TLV320ADC6140IRTWR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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