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TLV27L1IDBVRG4

Texas Instruments

TLV27L1IDBVRG4 by Texas Instruments

TLV27L1IDBVRG4 by Texas Instruments is an Operational Amplifier with 7000uV Max Input Offset Voltage, 86dB Nominal CMRR, and 160kHz Unity Gain Bandwidth. Ideal for automotive applications due to its low-bias, micropower design and BIMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 6,502 parts In-Stock

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Vyrian

USA . 3,275 parts In-Stock

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3,275

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Digiode

USA . 1,569 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Semicontronic

India . 611 parts In-Stock

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$1.410

100+ parts

$1.375

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$1.368

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611

$1.410

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$1.368

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Corohmni

South Africa . 231 parts In-Stock

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$2.178

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One Stop Electronics

USA . 1,367 parts In-Stock

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$3.410

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$3.410

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Parana Technologies

USA . 533 parts In-Stock

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$4.230

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$4.666

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533

$4.230

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$4.666

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Ampacity Inc.

Singapore . 1,614 parts In-Stock

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$4.410

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DigiPath Technology Company

USA . 8 parts In-Stock

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$4.658

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$4.285

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$4.285

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ChromeModa Solutions

Germany . 5,495 parts In-Stock

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$4.753

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$3.897

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IDEA Electronic Components Group

UK . 904 parts In-Stock

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$4.753

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$4.278

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AZTECH Wire

Italy . 400 parts In-Stock

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$15.286

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QUARKTWIN TECHNOLOGY LTD

USA . 17,609 parts In-Stock

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Continental Prestige Electronics

USA . 3,604 parts In-Stock

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Argo Parts USA

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Microchip USA

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Corphita

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Advanced Electronics

New Zealand . 15 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the TLV27L1IDBVRG4 by Texas Instruments. Crafted with unparalleled precision and expertise, this operational amplifier offers superior performance and reliability in a wide range of applications. From automotive to industrial, this compact and versatile device delivers exceptional value, efficiency, and accuracy. Trust in Texas Instruments to elevate your designs with cutting-edge technology and unmatched quality. Elevate your projects with the TLV27L1IDBVRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this Op Amp lightweight and durable, perfect for portable or rugged applications.

Maximum Input Offset Voltage: 7000 uV

With a low input offset voltage, this Op Amp provides accurate and precise signal processing, ensuring high performance in various circuits.

Maximum Average Bias Current (IIB): 0.001 uA

The low bias current of this Op Amp minimizes power consumption, making it ideal for low-power applications or battery-operated devices.

Surface Mount: YES

The surface mount capability of this Op Amp enables easy and efficient PCB assembly, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular package shape allows for space-efficient circuit designs, making this Op Amp suitable for compact electronic devices.

Nominal Common Mode Reject Ratio: 86 dB

With a high common mode rejection ratio, this Op Amp effectively eliminates unwanted noise and interference, ensuring clean and reliable signal processing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this Op Amp is versatile and can be used in a wide range of applications.

Power Supplies (V): +-1.35/+-8/2.7/16

This Op Amp can accommodate a variety of power supply voltages, making it flexible and compatible with different system configurations.

No. of Terminals: 5

The five terminals of this Op Amp provide simple and straightforward connectivity, simplifying the circuit design process.

Maximum Input Offset Current (IIO): 0.00006 uA

With a low input offset current, this Op Amp ensures minimal error in signal processing, enhancing overall accuracy and performance.

Technical Specifications

Operational Amplifiers (Op Amps) TLV27L1IDBVRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIMOS

Power Supply:

±1.35/±8/2.7/16 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

160 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

86 dB

Minimum Common Mode Rejection Ratio (CMRR ):

71 dB

Input Offset Voltage Limit:

7000 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

0.06 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

1 nA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

16.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

11 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV27L1IDBVRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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