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TLV2782CDG4

Texas Instruments

TLV2782CDG4 by Texas Instruments

TLV2782CDG4 by Texas Instruments is a CMOS Operational Amplifier with low-bias and micropower features. It offers 4500uV max input offset voltage, 1.89 V/us min slew rate, and 80 dB nominal CMRR. Ideal for applications requiring high voltage gain, low bias current, and micropower consumption in commercial temperature range.

Median Price

$3.160

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 165 parts In-Stock

1+ parts

$3.160

100+ parts

$2.320

1k+ parts

$1.970

10k+ parts

$1.520

165

$3.160

$2.320

$1.970

$1.520

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,204 parts In-Stock

1+ parts

$3.002

100+ parts

-

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3,204

$3.002

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Vyrian

USA . 5,470 parts In-Stock

1+ parts

-

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5,470

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 416 parts In-Stock

1+ parts

$2.844

100+ parts

-

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416

$2.844

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Parana Technologies

USA . 1,578 parts In-Stock

1+ parts

$3.847

100+ parts

-

1k+ parts

$4.333

10k+ parts

-

1,578

$3.847

-

$4.333

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DigiPath Technology Company

USA . 1,620 parts In-Stock

1+ parts

$4.236

100+ parts

$3.897

1k+ parts

-

10k+ parts

-

1,620

$4.236

$3.897

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ChromeModa Solutions

Germany . 4,235 parts In-Stock

1+ parts

$4.322

100+ parts

$3.544

1k+ parts

-

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4,235

$4.322

$3.544

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IDEA Electronic Components Group

UK . 2,039 parts In-Stock

1+ parts

$4.322

100+ parts

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1k+ parts

$3.890

10k+ parts

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2,039

$4.322

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$3.890

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Component Stockers USA

USA . 780 parts In-Stock

1+ parts

$99.990

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780

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 19,383 parts In-Stock

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Microchip USA

USA . 3,938 parts In-Stock

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Perfect Parts

USA . 159 parts In-Stock

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159

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Overview

Unlock the power of high-quality operational amplifiers with the TLV2782CDG4 by Texas Instruments. Known for their superior manufacturing standards, Texas Instruments delivers a reliable product that offers precision and performance. Ideal for a wide range of applications, these operational amplifiers provide exceptional value to customers seeking efficiency and accuracy in their electronic designs. Experience the benefits of top-notch technology and trust Texas Instruments to meet your amplifier needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier, ensuring longevity and reliability.

Maximum Input Offset Voltage: 4500 uV

Low input offset voltage helps in achieving accurate and precise amplification of signals without distortion.

Maximum Average Bias Current (IIB): 0.0001 uA

Low bias current ensures minimal distortion and accurate signal processing.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying the manufacturing process.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio ensures that the operational amplifier can effectively reject common mode noise, resulting in clean and accurate output signals.

Nominal Supply Voltage / Vsup (V): 2.7

Operates at a low supply voltage, making it suitable for low power applications and extending battery life.

Minimum Slew Rate: 1.89 V/us

Fast slew rate allows the operational amplifier to respond quickly to changes in input signals, improving overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the operational amplifier efficient and reliable.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, it is versatile and widely used in various electronic circuits for amplification, signal processing, and filtering.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2782CDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±0.9/±1.8/1.8/3.6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

55 dB

Input Offset Voltage Limit:

4500 uV

Minimum Voltage Gain:

50000

Minimum Slew Rate:

1.89 V/us

Nominal Slew Rate:

4.8 V/us

Maximum Input Offset Current (IIO):

15 pA

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

15 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

4 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1.54 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2782CDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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