Loading...

TLV2781CDBVT

Texas Instruments

TLV2781CDBVT by Texas Instruments

TLV2781CDBVT by Texas Instruments is a micropower operational amplifier with low bias current. It offers a max input offset voltage of 4500 uV, 80 dB common mode reject ratio, and 1.89 V/us slew rate. Ideal for applications requiring precise signal amplification in compact designs.

Median Price

$1.183

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 27,622 parts In-Stock

1+ parts

$1.183

100+ parts

$0.977

1k+ parts

$0.528

10k+ parts

-

27,622

$1.183

$0.977

$0.528

-

Mouser Electronics

USA . 85 parts In-Stock

1+ parts

$1.740

100+ parts

$1.040

1k+ parts

$0.882

10k+ parts

$0.852

85

$1.740

$1.040

$0.882

$0.852

Rochester

USA . 880 parts In-Stock

1+ parts

-

100+ parts

$1.030

1k+ parts

$0.855

10k+ parts

$0.762

880

-

$1.030

$0.855

$0.762

DigiKey

USA . 880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.290

10k+ parts

-

880

-

-

$1.290

-

Verical

USA . 880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.069

10k+ parts

$0.953

880

-

-

$1.069

$0.953

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,711 parts In-Stock

1+ parts

$0.696

100+ parts

-

1k+ parts

-

10k+ parts

-

4,711

$0.696

-

-

-

Vyrian

USA . 7,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,364

-

-

-

-

Chip Stock

USA . 4,510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,510

-

-

-

-

NexGen Digital

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

SPM Sales

USA . 185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

185

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,923 parts In-Stock

1+ parts

$0.660

100+ parts

-

1k+ parts

-

10k+ parts

-

2,923

$0.660

-

-

-

Parana Technologies

USA . 1,452 parts In-Stock

1+ parts

$1.400

100+ parts

-

1k+ parts

$2.107

10k+ parts

-

1,452

$1.400

-

$2.107

-

ChromeModa Solutions

Germany . 4,140 parts In-Stock

1+ parts

$1.573

100+ parts

$1.290

1k+ parts

-

10k+ parts

-

4,140

$1.573

$1.290

-

-

IDEA Electronic Components Group

UK . 1,720 parts In-Stock

1+ parts

$1.573

100+ parts

-

1k+ parts

$1.416

10k+ parts

-

1,720

$1.573

-

$1.416

-

Perfect Parts

USA . 1,179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,179

-

-

-

-

DigiPath Technology Company

USA . 142 parts In-Stock

1+ parts

-

100+ parts

$1.418

1k+ parts

-

10k+ parts

-

142

-

$1.418

-

-

Overview

Experience superior performance and reliability with the TLV2781CDBVT by Texas Instruments, a leading manufacturer in the operational amplifiers category. This versatile product offers a wide range of applications, providing customers with exceptional value and benefits. From low-bias micropower operation to high-frequency compensation, this amplifier delivers precision and efficiency without compromising on quality. Trust Texas Instruments for innovative solutions that cater to your specific needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability to the product while keeping it lightweight and cost-effective.

Maximum Input Offset Voltage: 4500 uV

Low input offset voltage ensures accurate and precise amplification of signals.

Surface Mount: YES

Allows for easy and efficient PCB assembly, making it suitable for mass production.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio helps in eliminating unwanted noise and interference from the input signal.

Power Supplies (V): +-0.9/+-1.8/1.8/3.6

Offers a wide range of power supply options for flexibility in different applications.

Minimum Slew Rate: 1.89 V/us

Fast slew rate enables quick response to input signal changes, ideal for applications requiring high speed operation.

Frequency Compensation: YES

Provides stability and control over the frequency response of the amplifier.

Nominal Unity Gain Bandwidth: 8000 kHz

High unity gain bandwidth ensures efficient signal amplification across a wide frequency range.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making it energy-efficient and suitable for sensitive circuitry.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2781CDBVT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±0.9/±1.8/1.8/3.6 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

55 dB

Input Offset Voltage Limit:

4500 uV

Minimum Voltage Gain:

50000

Minimum Slew Rate:

1.89 V/us

Nominal Slew Rate:

4.8 V/us

Maximum Input Offset Current (IIO):

15 pA

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

15 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

4 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

770 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV2781CDBVT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20