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TLV2775IPWR

Texas Instruments

TLV2775IPWR by Texas Instruments

TLV2775IPWR by Texas Instruments is a CMOS Operational Amplifier with 4 functions, Vsup of 2.7V, and low bias current (0.00006 uA). Ideal for automotive applications due to its small size (5x4.4mm), low power consumption (8mA max), and wide temperature range (-40 to 125 °C).

Median Price

$3.060

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,504 parts In-Stock

1+ parts

$3.060

100+ parts

$1.887

1k+ parts

$1.675

10k+ parts

$1.584

3,504

$3.060

$1.887

$1.675

$1.584

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,590 parts In-Stock

1+ parts

$2.878

100+ parts

-

1k+ parts

-

10k+ parts

-

3,590

$2.878

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Vyrian

USA . 4,621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,621

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 866 parts In-Stock

1+ parts

$2.727

100+ parts

-

1k+ parts

-

10k+ parts

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866

$2.727

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Parana Technologies

USA . 1,315 parts In-Stock

1+ parts

$5.672

100+ parts

-

1k+ parts

$6.466

10k+ parts

-

1,315

$5.672

-

$6.466

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DigiPath Technology Company

USA . 1,642 parts In-Stock

1+ parts

$6.246

100+ parts

$5.746

1k+ parts

-

10k+ parts

-

1,642

$6.246

$5.746

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ChromeModa Solutions

Germany . 3,653 parts In-Stock

1+ parts

$6.373

100+ parts

$5.226

1k+ parts

-

10k+ parts

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3,653

$6.373

$5.226

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IDEA Electronic Components Group

UK . 2,191 parts In-Stock

1+ parts

$6.373

100+ parts

-

1k+ parts

$5.736

10k+ parts

-

2,191

$6.373

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$5.736

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Component Stockers USA

USA . 5,405 parts In-Stock

1+ parts

$17.340

100+ parts

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1k+ parts

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5,405

$17.340

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A-Z Elektronik GmbH

Germany . 10,961 parts In-Stock

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10,961

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Microchip USA

USA . 6,736 parts In-Stock

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6,736

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Overview

Elevate your designs with the TLV2775IPWR by Texas Instruments, a top-of-the-line operational amplifier that delivers unparalleled performance and reliability. With Texas Instruments' renowned expertise in semiconductor manufacturing, this op amp offers exceptional precision and efficiency for a wide range of applications. From automotive electronics to industrial control systems, this powerful component ensures optimal functionality and enhanced signal processing. Trust in Texas Instruments to provide cutting-edge technology that empowers your projects to reach new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material helps in reducing the overall weight of the operational amplifier, making it suitable for applications where weight is a concern.

Maximum Input Offset Voltage: 2900 uV

The low maximum input offset voltage ensures accurate output even with small input signals, making this operational amplifier suitable for precision applications.

Surface Mount: YES

The surface mount capability allows for easy and space-efficient mounting on PCBs, making it suitable for compact electronic devices.

Nominal Common Mode Reject Ratio: 82 dB

The high common mode reject ratio ensures that the amplifier can effectively reject noise and interference, leading to clean and accurate output signals.

Maximum Supply Voltage Limit: 7 V

The high maximum supply voltage limit provides flexibility in the choice of power supply, making this operational amplifier suitable for a wide range of applications.

Frequency Compensation: YES

The frequency compensation feature ensures stability and reliable performance over a wide range of operating frequencies, making it suitable for diverse applications.

Technology: CMOS

The CMOS technology offers low power consumption and high-speed operation, making this operational amplifier suitable for battery-powered and high-speed applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2775IPWR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

2.7/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4.8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

82 dB

Minimum Common Mode Rejection Ratio (CMRR ):

60 dB

Input Offset Voltage Limit:

2900 uV

Minimum Voltage Gain:

13000

Minimum Slew Rate:

4.7 V/us

Nominal Slew Rate:

6 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

350 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

8 mA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

16

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP16,.25

Trade Compliance

TLV2775IPWR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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