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TLV2772MDG4

Texas Instruments

TLV2772MDG4 by Texas Instruments

TLV2772MDG4 by Texas Instruments is a CMOS Operational Amplifier with 2 functions, offering low bias current of 0.00006 uA @25C and high common mode rejection ratio of 82 dB. Ideal for military applications due to MIL-STD-883 screening level, it operates at temperatures ranging from -55 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,860 parts In-Stock

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6,860

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Digiode

USA . 4,705 parts In-Stock

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4,705

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Distributors (Availability)

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Parana Technologies

USA . 1,474 parts In-Stock

1+ parts

$4.619

100+ parts

$428.954

1k+ parts

$4.157

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1,474

$4.619

$428.954

$4.157

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DigiPath Technology Company

USA . 1,267 parts In-Stock

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$5.086

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1,267

$5.086

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ChromeModa Solutions

Germany . 2,459 parts In-Stock

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$5.190

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$4.256

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2,459

$5.190

$4.256

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IDEA Electronic Components Group

UK . 1,512 parts In-Stock

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$5.190

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$4.671

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1,512

$5.190

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$4.671

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One Stop Electronics

USA . 300 parts In-Stock

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$7.410

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300

$7.410

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AZTECH Wire

Italy . 816 parts In-Stock

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$16.862

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816

$16.862

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Corphita

USA . 3,434 parts In-Stock

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Microchip USA

USA . 1,251 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the TLV2772MDG4 operational amplifier by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. Ideal for a wide range of applications, this operational amplifier offers exceptional performance and versatility. Trust in the TLV2772MDG4 to provide unmatched value and benefits, ensuring your projects are executed flawlessly. Elevate your design with Texas Instruments' superior technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the operational amplifier, ensuring reliability and durability.

Maximum Input Offset Voltage: 2700 uV

Low input offset voltage ensures accurate signal processing and minimal distortion in the output signal.

Surface Mount: YES

Surface mount technology offers ease of installation and space-saving design in electronic circuits.

Nominal Common Mode Reject Ratio: 82 dB

High common mode rejection ratio allows the amplifier to effectively reject noise and interference, resulting in a clean output signal.

Nominal Supply Voltage / Vsup (V): 2.7

Low supply voltage requirement makes it suitable for low power applications and battery-operated devices.

Minimum Slew Rate: 4.7 V/us

Fast slew rate enables the operational amplifier to respond quickly to changes in input signals, making it suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making the operational amplifier suitable for battery-powered devices and sensor applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows the amplifier to function reliably in various environmental conditions.

Minimum Voltage Gain: 13000

High voltage gain amplifies weak signals effectively, making it suitable for sensor interfaces and signal conditioning applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is versatile and can be used in various applications such as signal processing, amplification, and active filtering.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2772MDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

2.7/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4.8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

82 dB

Input Offset Voltage Limit:

2700 uV

Minimum Voltage Gain:

13000

Minimum Slew Rate:

4.7 V/us

Nominal Slew Rate:

6 V/us

Peak Bias Current:

350 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

4 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2772MDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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