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TLV2772AQPWRQ1

Texas Instruments

TLV2772AQPWRQ1 by Texas Instruments

TLV2772AQPWRQ1 by Texas Instruments is a CMOS Operational Amplifier with 1900uV Max Input Offset Voltage, 82dB Nominal CMRR, and 4.7V/us Min Slew Rate. Ideal for automotive applications due to AEC-Q100 screening level and low-bias design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,523 parts In-Stock

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7,523

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Digiode

USA . 2,309 parts In-Stock

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2,309

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,723 parts In-Stock

1+ parts

$2.180

100+ parts

$202.492

1k+ parts

$1.962

10k+ parts

-

1,723

$2.180

$202.492

$1.962

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DigiPath Technology Company

USA . 1,843 parts In-Stock

1+ parts

$2.401

100+ parts

$2.209

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1,843

$2.401

$2.209

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ChromeModa Solutions

Germany . 1,171 parts In-Stock

1+ parts

$2.450

100+ parts

$2.009

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1,171

$2.450

$2.009

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IDEA Electronic Components Group

UK . 678 parts In-Stock

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$2.450

100+ parts

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$2.205

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678

$2.450

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$2.205

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One Stop Electronics

USA . 671 parts In-Stock

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$6.410

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671

$6.410

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AZTECH Wire

Italy . 224 parts In-Stock

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$18.359

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224

$18.359

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Component Stockers USA

USA . 400 parts In-Stock

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$99.990

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400

$99.990

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Corphita

USA . 1,947 parts In-Stock

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Microchip USA

USA . 244 parts In-Stock

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Overview

Experience superior performance and reliability with the TLV2772AQPWRQ1 by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology. As a part of the Operational Amplifiers category, this product offers exceptional precision and efficiency for various applications in automotive electronics, industrial automation, and consumer electronics. With its low bias current, high common-mode rejection ratio, and wide supply voltage range, customers can trust in the value and benefits that this product provides. Upgrade your designs with the TLV2772AQPWRQ1 and elevate your projects to new heights of quality and excellence.

Feature Benefit Bullets

Package Body Material

This material is lightweight and durable, making the product suitable for various applications.

Maximum Input Offset Voltage

Low input offset voltage ensures accurate signal processing and minimal error in the output.

Maximum Average Bias Current (IIB)

Low bias current minimizes power consumption and ensures stable operation of the amplifier.

Surface Mount

Surface mount capability allows for easy integration onto PCBs, making installation and assembly more convenient.

No. of Functions

Having multiple functions in one device saves space on the circuit board and simplifies circuit design.

Nominal Common Mode Reject Ratio

High common mode rejection ratio ensures that common mode noise is effectively rejected, resulting in cleaner output signals.

Nominal Supply Voltage / Vsup (V)

Low supply voltage requirement allows for operation in low power applications and extends battery life.

Minimum Slew Rate

Fast slew rate enables rapid response to changes in input signals, making the amplifier suitable for applications requiring high speed operation.

Maximum Supply Voltage Limit

High supply voltage limit provides flexibility in power supply options for the amplifier.

Maximum Operating Temperature

Wide operating temperature range allows for use in harsh environments and automotive applications.

Frequency Compensation

Frequency compensation ensures stability and prevents oscillations in the amplifier circuit.

Maximum Seated Height

Low profile design with small seated height saves space and allows for compact circuit board layout.

Nominal Unity Gain Bandwidth

High unity gain bandwidth ensures high frequency response and suitability for audio and RF applications.

Technology

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the amplifier.

Amplifier Type

Operational amplifiers are versatile and widely used in various electronic circuits for amplification, filtering, and signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2772AQPWRQ1 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4.8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

82 dB

Input Offset Voltage Limit:

1900 uV

Minimum Voltage Gain:

13000

Minimum Slew Rate:

4.7 V/us

Nominal Slew Rate:

6 V/us

Peak Bias Current:

350 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

4 mA

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TLV2772AQPWRQ1 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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