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TLV2631IDBVR

Texas Instruments

TLV2631IDBVR by Texas Instruments

TLV2631IDBVR by Texas Instruments is a CMOS Operational Amplifier with 4500uV Max Input Offset Voltage, 100dB Nominal CMRR, and 6 V/us Min Slew Rate. Ideal for automotive applications due to low-bias design and small form factor.

Median Price

$0.400

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 69,000 parts In-Stock

1+ parts

$0.400

100+ parts

$0.390

1k+ parts

$0.380

10k+ parts

-

69,000

$0.400

$0.390

$0.380

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,363 parts In-Stock

1+ parts

$1.264

100+ parts

-

1k+ parts

-

10k+ parts

-

4,363

$1.264

-

-

-

Vyrian

USA . 4,682 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,682

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 898 parts In-Stock

1+ parts

$1.197

100+ parts

-

1k+ parts

-

10k+ parts

-

898

$1.197

-

-

-

Parana Technologies

USA . 2,062 parts In-Stock

1+ parts

$3.883

100+ parts

-

1k+ parts

$4.362

10k+ parts

-

2,062

$3.883

-

$4.362

-

IDEA Electronic Components Group

UK . 637 parts In-Stock

1+ parts

$4.363

100+ parts

-

1k+ parts

$3.927

10k+ parts

-

637

$4.363

-

$3.927

-

ChromeModa Solutions

Germany . 101 parts In-Stock

1+ parts

$4.363

100+ parts

$3.578

1k+ parts

-

10k+ parts

-

101

$4.363

$3.578

-

-

Microchip USA

USA . 2,657 parts In-Stock

1+ parts

$4.740

100+ parts

$4.710

1k+ parts

$4.690

10k+ parts

$4.680

2,657

$4.740

$4.710

$4.690

$4.680

A-Z Elektronik GmbH

Germany . 11,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,960

-

-

-

-

DigiPath Technology Company

USA . 376 parts In-Stock

1+ parts

-

100+ parts

$3.934

1k+ parts

-

10k+ parts

-

376

-

$3.934

-

-

Overview

Discover the unparalleled performance and precision of the TLV2631IDBVR by Texas Instruments, a leading manufacturer known for delivering top-quality operational amplifiers. Designed for a wide range of applications, this compact and versatile Op Amp offers customers exceptional value with its high common mode rejection ratio and low bias current. Experience the benefits of reliable operation in automotive-grade environments, along with the convenience of surface mount packaging and minimal power consumption. Elevate your design projects with the TLV2631IDBVR and unlock new possibilities in voltage-feedback amplifier technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Maximum Input Offset Voltage: 4500 uV

Low input offset voltage ensures accuracy in signal processing and minimizes errors in the output.

Maximum Average Bias Current (IIB): 0.0002 uA

Low bias current results in minimal power consumption and helps maintain stability in the circuit.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on circuit boards, saving space and reducing overall system size.

Nominal Common Mode Reject Ratio: 100 dB

High common mode rejection ratio helps in rejecting noise and interference from the input signal, leading to a clean output.

Nominal Supply Voltage (Vsup): 5V

Operating at a nominal supply voltage of 5V makes the product compatible with a wide range of applications.

Minimum Slew Rate: 6 V/us

Fast slew rate enables the op amp to quickly respond to changes in input signals, improving overall performance.

Frequency Compensation: YES

Frequency compensation ensures stability and prevents oscillations, making the product reliable in different operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish ensures good conductivity and corrosion resistance, leading to reliable connections.

Nominal Unity Gain Bandwidth: 9000 kHz

High unity gain bandwidth allows for the amplification of signals up to 9 MHz, suitable for high-frequency applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2631IDBVR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±2.75/2.7/5.5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

9 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

100 dB

Minimum Common Mode Rejection Ratio (CMRR ):

77 dB

Input Offset Voltage Limit:

4500 uV

Minimum Voltage Gain:

31622

Minimum Slew Rate:

6 V/us

Nominal Slew Rate:

6 V/us

Maximum Input Offset Current (IIO):

50 pA

Peak Bias Current:

200 pA

Maximum Bias Current (IIB) @25 °C:

5 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1 mA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV2631IDBVR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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