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TLV2624IDR

Texas Instruments

TLV2624IDR by Texas Instruments

TLV2624IDR by Texas Instruments is a CMOS Operational Amplifier with 4 functions, Vsup of 5V, and low bias current. It has a max input offset voltage of 4500uV and operates in automotive-grade applications. The op amp offers a nominal unity gain bandwidth of 11MHz and features voltage-feedback architecture for precision performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,863 parts In-Stock

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Digiode

USA . 347 parts In-Stock

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347

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Parana Technologies

USA . 69 parts In-Stock

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$0.635

100+ parts

-

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$1.701

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69

$0.635

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$1.701

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DigiPath Technology Company

USA . 1,509 parts In-Stock

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$0.699

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1,509

$0.699

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ChromeModa Solutions

Germany . 6,355 parts In-Stock

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$0.713

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$0.585

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$0.585

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IDEA Electronic Components Group

UK . 1,974 parts In-Stock

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$0.713

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$0.642

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One Stop Electronics

USA . 663 parts In-Stock

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$1.410

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663

$1.410

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AZTECH Wire

Italy . 686 parts In-Stock

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$7.896

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Microchip USA

USA . 1,483 parts In-Stock

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$16.330

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$16.230

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$16.180

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$16.130

1,483

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$16.230

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$16.130

Component Stockers USA

USA . 776 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 10,010 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,930 parts In-Stock

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Corphita

USA . 4,673 parts In-Stock

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Perfect Parts

USA . 2,220 parts In-Stock

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Overview

Discover the unparalleled excellence of the TLV2624IDR operational amplifiers by Texas Instruments! With a top-tier manufacturer like TI, you can trust in the quality and reliability of this product. Ideal for a wide range of applications, these op amps offer precision and efficiency like no other. Experience the benefits of low bias current, high common mode rejection ratio, and a compact design that will elevate your projects to the next level. Elevate your work with TI's TLV2624IDR - the ultimate choice for all your operational amplifier needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier, making it suitable for a variety of applications.

Maximum Input Offset Voltage: 4500 uV

Low input offset voltage ensures accurate signal processing and minimizes errors in the output signal.

Maximum Average Bias Current (IIB): 0.0002 uA

Low bias current helps in reducing power consumption and improves the efficiency of the operational amplifier.

Surface Mount: YES

Ease of installation and space-saving design make it suitable for compact electronic devices and PCB layouts.

Nominal Common Mode Reject Ratio: 99 dB

High common-mode rejection ratio ensures that the operational amplifier can effectively reject common-mode signals and focus on the differential signal.

Power Supplies (V): 3/5

Versatile power supply options make it compatible with a wide range of voltage inputs and applications.

Minimum Slew Rate: 2.3 V/us

Fast slew rate allows the operational amplifier to respond quickly to input signal changes, making it suitable for high-frequency applications.

Minimum Voltage Gain: 31622

High voltage gain amplifies weak input signals effectively, improving the overall performance of the operational amplifier.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the operational amplifier to function reliably in various environmental conditions.

Nominal Unity Gain Bandwidth: 11000 kHz

Wide unity gain bandwidth ensures stable and accurate operation of the operational amplifier across a range of frequencies.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2624IDR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

11 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

99 dB

Minimum Common Mode Rejection Ratio (CMRR ):

78 dB

Input Offset Voltage Limit:

4500 uV

Minimum Voltage Gain:

31622

Minimum Slew Rate:

2.3 V/us

Nominal Slew Rate:

7 V/us

Maximum Input Offset Current (IIO):

50 pA

Peak Bias Current:

200 pA

Maximum Bias Current (IIB) @25 °C:

50 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

4 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLV2624IDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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