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TLV2548MFKB

Texas Instruments

TLV2548MFKB by Texas Instruments

TLV2548MFKB by Texas Instruments is a 12-bit ADC with 8 analog in channels, 0.0293% linearity error, and 4.65us conversion time. Ideal for military applications due to its ceramic-metal package, it operates at -55 to 125°C with a sample rate of 0.2MHz.

Median Price

$1,856.970

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 10 parts In-Stock

1+ parts

$805.580

100+ parts

-

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10

$805.580

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Rochester

USA . 197 parts In-Stock

1+ parts

$1,650.640

100+ parts

$1,551.600

1k+ parts

$1,452.560

10k+ parts

-

197

$1,650.640

$1,551.600

$1,452.560

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DigiKey

USA . 197 parts In-Stock

1+ parts

$2,063.300

100+ parts

-

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197

$2,063.300

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Verical

USA . 197 parts In-Stock

1+ parts

$2,063.300

100+ parts

$1,939.500

1k+ parts

$1,815.700

10k+ parts

-

197

$2,063.300

$1,939.500

$1,815.700

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 803 parts In-Stock

1+ parts

$765.301

100+ parts

-

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803

$765.301

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Vyrian

USA . 7,572 parts In-Stock

1+ parts

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7,572

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Cyclops Electronics Ltd

UK . 66 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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Holdelec - ElecDif-Pro

France . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,061 parts In-Stock

1+ parts

$22.696

100+ parts

-

1k+ parts

$23.357

10k+ parts

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1,061

$22.696

-

$23.357

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DigiPath Technology Company

USA . 2,327 parts In-Stock

1+ parts

$24.991

100+ parts

$22.992

1k+ parts

-

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2,327

$24.991

$22.992

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ChromeModa Solutions

Germany . 4,795 parts In-Stock

1+ parts

$25.501

100+ parts

$20.911

1k+ parts

-

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4,795

$25.501

$20.911

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IDEA Electronic Components Group

UK . 939 parts In-Stock

1+ parts

$25.501

100+ parts

$24.226

1k+ parts

$22.951

10k+ parts

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939

$25.501

$24.226

$22.951

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Corphita

USA . 979 parts In-Stock

1+ parts

$725.022

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-

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979

$725.022

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Ampacity Inc.

Singapore . 150 parts In-Stock

1+ parts

$1,490.320

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150

$1,490.320

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Microchip USA

USA . 2,327 parts In-Stock

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2,327

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GreenTree Electronics

Israel . 66 parts In-Stock

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66

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Perfect Parts

USA . 4 parts In-Stock

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4

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Overview

Upgrade your analog-to-digital conversion experience with the TLV2548MFKB by Texas Instruments. With a superior build quality and unmatched precision, this ADC offers 12 bits of accuracy across 8 channels. Perfect for military-grade applications, this chip carrier package is surface mountable and operates at a maximum temperature of 125°C. Trust in Texas Instruments for top-of-the-line performance and reliability in all your conversion needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability, making this product suitable for harsh environments.

No. of Analog In Channels: 8

With 8 analog input channels, this product allows for versatile input options and can handle multiple input signals simultaneously.

Surface Mount: YES

Being surface mountable makes installation and PCB assembly easier, saving time and effort during production.

Maximum Linearity Error (EL): 0.0293 %

The low linearity error of 0.0293% ensures accurate conversion of analog signals to digital signals, making this product reliable for precise measurements.

Power Supplies (V): 3.3/5

This product can operate with power supplies of either 3.3V or 5V, providing flexibility in power source selection.

No. of Terminals: 20

With 20 terminals, this product offers sufficient connectivity options for interfacing with other components or devices.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for compact and efficient integration into electronic circuits, saving space and reducing overall system size.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can function reliably in high-temperature environments.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, enhancing the performance and efficiency of this product.

Technical Specifications

Analog-to-Digital Converters TLV2548MFKB attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0293 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

4.65 µs

Electrical Specifications

Power Supplies:

3.3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

3 V

Maximum Supply Current:

2.4 mA

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.35 in (8.89 mm)

Length:

0.35 in (8.89 mm)

Maximum Seated Height:

0.08 in (2.03 mm)

Packaging

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC20,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-CQCC-N20

Qualified:

No

Trade Compliance

TLV2548MFKB Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-598-4946, 5962015984946

NIIN

015984946

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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