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TLV2548CDWR

Texas Instruments

TLV2548CDWR by Texas Instruments

TLV2548CDWR by Texas Instruments is a 12-bit ADC with 8 analog in channels, 0.0244% EL, and 3/5 V power supplies. Ideal for commercial applications, it offers a sample rate of 0.2 MHz and operates at temperatures from 0 to 70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,482 parts In-Stock

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Digiode

USA . 4,674 parts In-Stock

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4,674

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Chip Stock

USA . 177 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 578 parts In-Stock

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$5.000

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578

$5.000

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AZTECH Wire

Italy . 473 parts In-Stock

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$8.926

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473

$8.926

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Parana Technologies

USA . 1,889 parts In-Stock

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$15.128

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$15.534

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1,889

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$15.534

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DigiPath Technology Company

USA . 1,612 parts In-Stock

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$16.658

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$16.658

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ChromeModa Solutions

Germany . 4,821 parts In-Stock

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$16.998

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$13.938

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4,821

$16.998

$13.938

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IDEA Electronic Components Group

UK . 1,272 parts In-Stock

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$16.998

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$16.148

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$15.298

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$16.998

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$15.298

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Microchip USA

USA . 1,893 parts In-Stock

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$115.790

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$113.780

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$112.770

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$111.770

1,893

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$113.780

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$111.770

A-Z Elektronik GmbH

Germany . 6,615 parts In-Stock

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Corphita

USA . 621 parts In-Stock

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Kepictronics

USA . 114 parts In-Stock

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Overview

Upgrade your analog-to-digital conversion capabilities with the Texas Instruments TLV2548CDWR. With a commitment to quality and precision, Texas Instruments delivers cutting-edge technology in a compact package. This versatile converter boasts 8 analog input channels, 12 bits of resolution, and a fast conversion time of just 3.86 microseconds. Ideal for a wide range of applications, from industrial automation to consumer electronics, this ADC offers unparalleled performance and reliability. Trust Texas Instruments to provide the value and benefits you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product suitable for a wide range of applications.

No. of Analog In Channels: 8

With 8 analog input channels, this product allows for multiple input signals to be converted simultaneously, increasing efficiency.

Surface Mount: YES

Being surface mountable makes installation of this product easy and convenient in modern electronic circuits.

No. of Bits: 12

With a high resolution of 12 bits, this ADC provides accurate and precise conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.0244 %

The low linearity error ensures accuracy in conversion, making this product reliable for critical applications.

Power Supplies (V): 3/5

Support for dual power supplies at 3V and 5V allows flexibility in voltage requirements for different applications.

No. of Terminals: 20

Having 20 terminals enables easy connectivity and integration of the ADC into electronic systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement allows for operation in low-power applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this ADC can perform reliably in a variety of environments.

Technical Specifications

Analog-to-Digital Converters TLV2548CDWR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

3.86 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

1.6 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV2548CDWR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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