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TLV2544QDR

Texas Instruments

TLV2544QDR by Texas Instruments

TLV2544QDR by Texas Instruments is a 12-bit ADC with 4 analog in channels, 0.0293% EL, and 0.2 MHz sample rate. Ideal for automotive applications due to its small outline package style and nickel palladium gold terminal finish. It operates at -40 to 125°C temperature range with a supply voltage of 3-5V.

Median Price

$20.462

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 605 parts In-Stock

1+ parts

-

100+ parts

$16.370

1k+ parts

$14.650

10k+ parts

$13.780

605

-

$16.370

$14.650

$13.780

DigiKey

USA . 605 parts In-Stock

1+ parts

-

100+ parts

$21.540

1k+ parts

-

10k+ parts

-

605

-

$21.540

-

-

Verical

USA . 605 parts In-Stock

1+ parts

-

100+ parts

$20.462

1k+ parts

$18.313

10k+ parts

$17.225

605

-

$20.462

$18.313

$17.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 464 parts In-Stock

1+ parts

$8.630

100+ parts

-

1k+ parts

-

10k+ parts

-

464

$8.630

-

-

-

Digiode

USA . 2,485 parts In-Stock

1+ parts

$8.636

100+ parts

-

1k+ parts

-

10k+ parts

-

2,485

$8.636

-

-

-

DigiKey Marketplace

USA . 3,706 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,706

-

-

-

-

Component Sense

UK . 670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

670

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,101 parts In-Stock

1+ parts

$5.456

100+ parts

-

1k+ parts

$6.177

10k+ parts

-

1,101

$5.456

-

$6.177

-

DigiPath Technology Company

USA . 484 parts In-Stock

1+ parts

$6.007

100+ parts

-

1k+ parts

-

10k+ parts

-

484

$6.007

-

-

-

ChromeModa Solutions

Germany . 3,118 parts In-Stock

1+ parts

$6.130

100+ parts

$5.027

1k+ parts

-

10k+ parts

-

3,118

$6.130

$5.027

-

-

IDEA Electronic Components Group

UK . 784 parts In-Stock

1+ parts

$6.130

100+ parts

-

1k+ parts

$5.517

10k+ parts

-

784

$6.130

-

$5.517

-

Corphita

USA . 4,404 parts In-Stock

1+ parts

$8.181

100+ parts

-

1k+ parts

-

10k+ parts

-

4,404

$8.181

-

-

-

Microchip USA

USA . 4,973 parts In-Stock

1+ parts

$19.360

100+ parts

$19.080

1k+ parts

$18.940

10k+ parts

$18.800

4,973

$19.360

$19.080

$18.940

$18.800

A-Z Elektronik GmbH

Germany . 5,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,585

-

-

-

-

Overview

Experience superior performance and precision with the TLV2544QDR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Analog-to-Digital Converters that cater to a variety of applications. With a compact package design and high-quality materials, this product offers customers unparalleled value and reliability. Say goodbye to accuracy issues and hello to seamless operation with the TLV2544QDR - your ultimate solution for all your analog-to-digital conversion needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package material provides durability and reliability for the analog-to-digital converter, making it suitable for various environments and applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile input signal processing, making the converter suitable for applications requiring multiple inputs.

Surface Mount: YES

The surface mount capability makes it easy to integrate the converter into circuit boards, saving space and facilitating assembly.

No. of Bits: 12

The 12-bit resolution provides high precision in converting analog signals to digital data, ensuring accurate and reliable conversion.

Maximum Linearity Error (EL): 0.0293 %

The low linearity error percentage ensures minimal deviations in the conversion process, resulting in accurate digital representation of analog signals.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V power supplies offers flexibility in operating the converter, allowing compatibility with various system requirements.

No. of Terminals: 16

With 16 terminals, the converter enables easy connectivity and integration with other components in the circuit, simplifying the overall system design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and applications with size constraints.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement of 3V ensures efficient power utilization and compatibility with lower voltage systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance allows the converter to function reliably in harsh environmental conditions with elevated temperatures.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the performance and efficiency of the analog-to-digital converter.

Technical Specifications

Analog-to-Digital Converters TLV2544QDR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0293 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

4.65 µs

Electrical Specifications

Power Supplies:

3.3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

3 V

Maximum Supply Current:

2.4 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.39 in (9.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP16,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV2544QDR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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