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TLV2543IDWR

Texas Instruments

TLV2543IDWR by Texas Instruments

TLV2543IDWR by Texas Instruments is a 12-bit ADC with 11 analog in channels, 0.0244% EL, and 10us max conversion time. Ideal for industrial applications requiring high precision data acquisition in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,841 parts In-Stock

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6,841

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Digiode

USA . 4,057 parts In-Stock

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4,057

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Distributors (Availability)

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AZTECH Wire

Italy . 435 parts In-Stock

1+ parts

$5.854

100+ parts

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435

$5.854

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Parana Technologies

USA . 1,707 parts In-Stock

1+ parts

$10.685

100+ parts

-

1k+ parts

$11.174

10k+ parts

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1,707

$10.685

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$11.174

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DigiPath Technology Company

USA . 445 parts In-Stock

1+ parts

$11.766

100+ parts

$10.825

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445

$11.766

$10.825

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ChromeModa Solutions

Germany . 3,025 parts In-Stock

1+ parts

$12.006

100+ parts

$9.845

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3,025

$12.006

$9.845

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IDEA Electronic Components Group

UK . 865 parts In-Stock

1+ parts

$12.006

100+ parts

$11.406

1k+ parts

$10.805

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865

$12.006

$11.406

$10.805

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One Stop Electronics

USA . 232 parts In-Stock

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$26.000

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232

$26.000

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Microchip USA

USA . 1,412 parts In-Stock

1+ parts

$30.550

100+ parts

$30.110

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$29.890

10k+ parts

$29.680

1,412

$30.550

$30.110

$29.890

$29.680

S.R.D Solutions

India . 30,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,135 parts In-Stock

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Corphita

USA . 1,262 parts In-Stock

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Overview

Experience exceptional precision and reliability with the TLV2543IDWR Analog-to-Digital Converter by Texas Instruments. Crafted with quality materials and cutting-edge technology, this converter offers 11 analog input channels and 12 bits of resolution for accurate data capture in a compact package. Ideal for industrial applications, it operates flawlessly in temperatures ranging from -40°C to 85°C, delivering fast conversion times and low power consumption. Trust in Texas Instruments for superior performance and efficiency in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good durability and protection for the internal components of the converter, making it suitable for various environments.

No. of Analog In Channels: 11

With 11 analog input channels, this converter can handle multiple input signals simultaneously, making it versatile for different applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

No. of Bits: 12

The 12-bit resolution ensures accurate conversion of analog signals to digital data, providing high precision in data acquisition.

Maximum Linearity Error (EL): 0.0244 %

The low linearity error ensures minimal distortion in the converted digital data, resulting in reliable and accurate output readings.

Power Supplies (V): 3.3

Operating at 3.3V, this converter is compatible with common power supply systems, making it easy to integrate into existing setups.

No. of Terminals: 20

With 20 terminals, this converter offers versatile connectivity options for input and output signals, allowing for flexible integration in different systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices where size is a constraint.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures stable operation of the converter, making it reliable even in fluctuating power conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this converter can withstand high temperature environments, suitable for industrial applications.

Technology: CMOS

The CMOS technology used in this converter ensures low power consumption and high-speed performance, making it efficient for various applications.

Maximum Analog Input Voltage: 3.6 V

The maximum analog input voltage of 3.6V allows for a wide range of input signals to be accurately converted to digital data, increasing the versatility of the converter.

Technical Specifications

Analog-to-Digital Converters TLV2543IDWR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

66 kHz

Hold Mode:

Sample

Maximum Conversion Time:

10 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

3.6 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

3 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.505 in (12.825 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV2543IDWR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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