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TLV2542IDR

Texas Instruments

TLV2542IDR by Texas Instruments

TLV2542IDR by Texas Instruments is a 12-bit ADC with 2 analog input channels. It operates on 3/5V supplies, has a conversion time of 3.5us, and offers 0.0244% linearity error. Ideal for industrial applications requiring small outline packages and high-speed sampling up to 0.2MHz.

Median Price

$6.641

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$6.641

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$6.641

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Digiode

USA . 2,621 parts In-Stock

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Vyrian

USA . 2,223 parts In-Stock

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2,223

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 100 parts In-Stock

1+ parts

$6.641

100+ parts

-

1k+ parts

$6.309

10k+ parts

$6.176

100

$6.641

-

$6.309

$6.176

AZTECH Wire

Italy . 280 parts In-Stock

1+ parts

$16.234

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280

$16.234

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Parana Technologies

USA . 226 parts In-Stock

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$21.581

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$21.973

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226

$21.581

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$21.973

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DigiPath Technology Company

USA . 1,669 parts In-Stock

1+ parts

$23.763

100+ parts

$21.862

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$23.763

$21.862

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Microchip USA

USA . 2,707 parts In-Stock

1+ parts

$24.040

100+ parts

$23.700

1k+ parts

$23.520

10k+ parts

$23.350

2,707

$24.040

$23.700

$23.520

$23.350

ChromeModa Solutions

Germany . 6,554 parts In-Stock

1+ parts

$24.248

100+ parts

$19.883

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$24.248

$19.883

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IDEA Electronic Components Group

UK . 803 parts In-Stock

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$24.248

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$23.036

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$21.823

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803

$24.248

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$21.823

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Ampacity Inc.

Singapore . 684 parts In-Stock

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$33.000

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$33.000

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One Stop Electronics

USA . 650 parts In-Stock

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$33.000

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650

$33.000

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,753 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,223 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Corphita

USA . 1,219 parts In-Stock

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Metaverse IC Inc.

Canada . 592 parts In-Stock

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592

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Overview

Unlock the power of precise analog-to-digital conversion with the TLV2542IDR by Texas Instruments. Known for their quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this ADC offers fast conversion times and minimal linearity error, ensuring accurate results every time. Trust Texas Instruments to provide industry-leading solutions that bring value and performance to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in input sources, making it suitable for various applications.

Surface Mount: YES

The surface mount feature makes installation and mounting of the product easy and convenient.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy integration into circuit designs.

No. of Bits: 12

The 12-bit resolution ensures high-precision conversion of analog signals to digital, making it suitable for accurate data acquisition.

Maximum Linearity Error (EL): 0.0244 %

The low linearity error ensures accurate and reliable conversion results.

Power Supplies (V): 3/5

Support for multiple power supply options gives flexibility in system integration and compatibility.

No. of Terminals: 8

Having 8 terminals provides enough connectivity options for interfacing with other components and systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for compact designs.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement allows for operation in power-constrained environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in varied environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, optimizing the performance of the ADC.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold feature ensures accurate conversion of analog signals by stabilizing the input voltage during the conversion process.

Technical Specifications

Analog-to-Digital Converters TLV2542IDR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

3.5 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

1.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV2542IDR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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