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TLV2541IDG4

Texas Instruments

TLV2541IDG4 by Texas Instruments

TLV2541IDG4 by Texas Instruments is a 12-bit ADC with 0.0244% EL, 3/5 V supplies, and 0.2 MHz sample rate. Ideal for industrial applications, it features a small outline package, operates from -40 to 85 °C, and has a max conversion time of 3.5 us.

Median Price

$32.070

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$32.070

100+ parts

$17.020

1k+ parts

-

10k+ parts

-

1

$32.070

$17.020

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,994 parts In-Stock

1+ parts

$16.435

100+ parts

-

1k+ parts

-

10k+ parts

-

4,994

$16.435

-

-

-

Vyrian

USA . 2,265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,265

-

-

-

-

Euro-Tech

UK . 75 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

75

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,512 parts In-Stock

1+ parts

$15.570

100+ parts

-

1k+ parts

-

10k+ parts

-

3,512

$15.570

-

-

-

Parana Technologies

USA . 522 parts In-Stock

1+ parts

$22.351

100+ parts

-

1k+ parts

$23.027

10k+ parts

-

522

$22.351

-

$23.027

-

DigiPath Technology Company

USA . 1,540 parts In-Stock

1+ parts

$24.612

100+ parts

$22.643

1k+ parts

-

10k+ parts

-

1,540

$24.612

$22.643

-

-

ChromeModa Solutions

Germany . 5,558 parts In-Stock

1+ parts

$25.114

100+ parts

$20.593

1k+ parts

-

10k+ parts

-

5,558

$25.114

$20.593

-

-

IDEA Electronic Components Group

UK . 374 parts In-Stock

1+ parts

$25.114

100+ parts

$23.858

1k+ parts

$22.603

10k+ parts

-

374

$25.114

$23.858

$22.603

-

Microchip USA

USA . 1,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,690

-

-

-

-

Overview

Discover the precision and reliability of the TLV2541IDG4 Analog-to-Digital Converter by Texas Instruments. With a maximum linearity error of just 0.0244% and a fast conversion time of 3.5 us, this small outline package offers industrial-grade performance for a wide range of applications. From industrial automation to sensor systems, this ADC delivers accurate results with minimal power consumption, making it the ideal choice for demanding projects. Experience the quality and innovation that Texas Instruments is known for with the TLV2541IDG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material is durable, lightweight, and cost-effective, making this product suitable for a wide range of applications.

Surface Mount: YES

Surface mount packaging allows for easy installation on circuit boards, saving space and reducing manufacturing costs.

No. of Bits: 12

High resolution of 12 bits provides accurate conversion of analog signals to digital data, making this product ideal for precise measurement applications.

Maximum Linearity Error (EL): 0.0244 %

Low linearity error ensures accurate and reliable analog-to-digital conversion, resulting in high-quality output data.

Power Supplies (V): 3/5

Wide range of power supply options (3V or 5V) allows for flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 8

Eight terminals provide easy connectivity and integration into circuits, simplifying the overall design process.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards, making this product suitable for compact electronic devices and systems.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage requirement enables operation in low-power environments, increasing energy efficiency and battery life.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of up to 85°C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for operation in extreme cold environments without compromising performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel, palladium, and gold finish on terminals provides excellent conductivity, corrosion resistance, and solderability, enhancing the product's reliability and longevity.

Maximum Conversion Time: 3.5 us

Fast conversion time of 3.5 microseconds ensures quick and efficient analog-to-digital signal processing, making this product suitable for real-time applications.

Maximum Seated Height: 1.75 mm

Low seated height of 1.75 millimeters allows for compact integration into electronic devices, reducing overall device profile.

Width: 3.9 mm

Compact width dimension of 3.9 millimeters saves space on circuit boards and allows for high-density mounting of components.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures robust soldering and assembly process during manufacturing.

Length: 4.9 mm

Short length of 4.9 millimeters reduces footprint on circuit boards, enabling efficient layout designs and space-saving solutions.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments and guarantees product performance under extreme temperature conditions.

Maximum Analog Input Voltage: 5.5 V

High maximum analog input voltage of 5.5 volts allows for versatile signal processing across a wide range of input voltages.

Sample Rate: 0.2 MHz

High sample rate of 0.2 megahertz facilitates rapid conversion of analog signals to digital data with high accuracy and precision.

Technology: CMOS

CMOS technology offers low power consumption, high speed performance, and excellent noise immunity, making this product efficient and reliable for various applications.

Terminal Form: GULL WING

Gull wing terminal form simplifies the soldering process and provides secure attachment to circuit boards, ensuring reliable electrical connections.

Maximum Supply Current: 1.5 mA

Low maximum supply current requirement of 1.5 milliamperes results in energy-efficient operation and reduced power consumption.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation analog-to-digital converter type offers high resolution, accuracy, and speed in converting analog signals to digital outputs, suitable for precision measurement applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 volts ensures consistent performance and reliable operation of the product in various voltage conditions.

Output Bit Code: BINARY

Binary output bit code simplifies data processing and communication protocols, providing a common format for digital data interpretation and analysis.

Terminal Pitch: 1.27 mm

Compact terminal pitch of 1.27 millimeters enables high-density mounting on circuit boards and simplifies assembly and integration processes.

Minimum Analog Input Voltage: 0 V

Low minimum analog input voltage of 0 volts allows for accurate conversion of small analog signals, providing precise digital representation of low-level input signals.

Output Format: SERIAL

Serial output format enables easy interfacing with microcontrollers and digital systems, facilitating data transmission and communication protocols.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold functionality ensures accurate conversion of analog signals by capturing and maintaining input voltage levels during the conversion process, improving overall precision and reliability.

Technical Specifications

Analog-to-Digital Converters TLV2541IDG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

3.5 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

1.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV2541IDG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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