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TLV2472IDGNG4

Texas Instruments

TLV2472IDGNG4 by Texas Instruments

TLV2472IDGNG4 by Texas Instruments is a CMOS Operational Amplifier with 2 functions, offering low-bias and frequency compensation. It has a max input offset voltage of 2400 uV, operates at temperatures from -40 to 125 °C, and is ideal for automotive applications due to its small outline package.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

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$1.000

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Vyrian

USA . 5,746 parts In-Stock

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Digiode

USA . 4,655 parts In-Stock

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Prism Electronics

USA . 8 parts In-Stock

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Parana Technologies

USA . 1,150 parts In-Stock

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$1.551

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$2.200

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$1.551

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DigiPath Technology Company

USA . 597 parts In-Stock

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$1.708

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$1.571

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597

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ChromeModa Solutions

Germany . 1,188 parts In-Stock

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$1.743

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$1.429

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$1.743

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IDEA Electronic Components Group

UK . 445 parts In-Stock

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$1.743

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$1.569

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$1.743

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$1.569

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Semicontronic

India . 768 parts In-Stock

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$2.410

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$2.350

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$2.338

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Aztec Data Supply Inc.

USA . 830 parts In-Stock

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$4.090

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Ampacity Inc.

Singapore . 1,414 parts In-Stock

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$7.410

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One Stop Electronics

USA . 556 parts In-Stock

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AZTECH Wire

Italy . 291 parts In-Stock

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Continental Prestige Electronics

USA . 6,788 parts In-Stock

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Corphita

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Argo Parts USA

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Microchip USA

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Perfect Parts

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Overview

Experience the superior quality and precision of Texas Instruments with the TLV2472IDGNG4 operational amplifiers. Designed for a wide range of applications, this innovative product offers customers exceptional value with its high performance and reliability. Whether you're working on automotive projects or industrial applications, the TLV2472IDGNG4 delivers unmatched benefits, making it the ideal choice for your next project. Trust Texas Instruments for top-notch technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a variety of applications.

Maximum Input Offset Voltage: 2400 uV

The low input offset voltage ensures accurate signal processing and minimal error in the output.

Maximum Average Bias Current (IIB): 0.0003 uA

The low bias current helps in minimizing power consumption and ensuring stable operation.

Surface Mount: YES

Surface mount capability makes the product easy to integrate into compact electronic designs.

Nominal Common Mode Reject Ratio: 78 dB

High common mode rejection ratio allows for effective rejection of common-mode noise in the input signal.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V enables compatibility with a wide range of power supplies.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and excellent noise immunity, making the product efficient and reliable.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, the product is versatile and can be used in various signal processing applications with high precision.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2472IDGNG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

78 dB

Minimum Common Mode Rejection Ratio (CMRR ):

64 dB

Input Offset Voltage Limit:

2400 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

0.6 V/us

Nominal Slew Rate:

1.4 V/us

Maximum Input Offset Current (IIO):

50 pA

Peak Bias Current:

300 pA

Maximum Bias Current (IIB) @25 °C:

50 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1.8 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.042 in (1.07 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

TLV2472IDGNG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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