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TLV2463QD

Texas Instruments

TLV2463QD by Texas Instruments

TLV2463QD by Texas Instruments is a CMOS Operational Amplifier with 2200uV Max Input Offset Voltage, 80dB Nominal CMRR, and 5200kHz Unity Gain Bandwidth. Ideal for automotive applications due to its small outline package and low bias current of 0.014uA @25C.

Median Price

$0.848

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24 parts In-Stock

1+ parts

-

100+ parts

$0.848

1k+ parts

$0.703

10k+ parts

$0.627

24

-

$0.848

$0.703

$0.627

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,150 parts In-Stock

1+ parts

$0.658

100+ parts

-

1k+ parts

-

10k+ parts

-

3,150

$0.658

-

-

-

Vyrian

USA . 8,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

8,624

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,864 parts In-Stock

1+ parts

$0.624

100+ parts

-

1k+ parts

-

10k+ parts

-

4,864

$0.624

-

-

-

Parana Technologies

USA . 1,620 parts In-Stock

1+ parts

$5.424

100+ parts

-

1k+ parts

$6.128

10k+ parts

-

1,620

$5.424

-

$6.128

-

ChromeModa Solutions

Germany . 1,965 parts In-Stock

1+ parts

$6.094

100+ parts

$4.997

1k+ parts

-

10k+ parts

-

1,965

$6.094

$4.997

-

-

IDEA Electronic Components Group

UK . 1,233 parts In-Stock

1+ parts

$6.094

100+ parts

-

1k+ parts

$5.485

10k+ parts

-

1,233

$6.094

-

$5.485

-

AZTECH Wire

Italy . 202 parts In-Stock

1+ parts

$10.720

100+ parts

-

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202

$10.720

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DigiPath Technology Company

USA . 1,400 parts In-Stock

1+ parts

-

100+ parts

$5.494

1k+ parts

-

10k+ parts

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1,400

-

$5.494

-

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Microchip USA

USA . 100 parts In-Stock

1+ parts

-

100+ parts

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100

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Overview

Elevate your electronic designs with the TLV2463QD operational amplifier from Texas Instruments, a leading manufacturer known for top-quality components. This versatile op amp offers unparalleled performance and precision in various applications, ensuring optimal signal processing and amplification. With its compact size, low power consumption, and wide supply voltage range, the TLV2463QD provides unbeatable value and reliability for your projects. Upgrade your circuits today and experience the superior benefits of this high-grade amplifier.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for the package body, ensuring reliability and affordability.

Maximum Input Offset Voltage: 2200 uV

Low input offset voltage helps in reducing errors and improving precision in signal processing.

Maximum Average Bias Current (IIB): 0.075 uA

Low bias current ensures minimal power consumption and accurate signal amplification.

Surface Mount: YES

Ease of integration onto circuit boards, saving space and enabling efficient assembly processes.

No. of Functions: 2

Being a dual-function operational amplifier, it offers versatility in signal processing applications.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio helps in eliminating unwanted noise and interference from the input signal.

Nominal Supply Voltage / Vsup (V): 3

Operates at a nominal supply voltage of 3V, suitable for low power applications.

Power Supplies (V): +-1.35/+-3/2.7/6

Wide range of power supply options accommodating different voltage requirements.

No. of Terminals: 14

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space on the PCB and allows for densely populated designs.

Minimum Slew Rate: 0.8 V/us

Fast slew rate enables rapid response to input signal changes, improving dynamic performance.

Maximum Supply Voltage Limit: 6 V

Safe operating limit for the supply voltage, preventing potential damage to the device.

Maximum Operating Temperature: 125 °C

Wide operating temperature range suitable for various environmental conditions.

Maximum Bias Current (IIB) @25°C: 0.014 uA

Low bias current at room temperature ensures stable and accurate operation.

Frequency Compensation: YES

Internal frequency compensation simplifies circuit design and stability considerations.

Minimum Voltage Gain: 28000

High minimum voltage gain ensures strong signal amplification capability.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in extreme cold environments.

Terminal Position: DUAL

Dual terminal position for versatile connectivity options in the circuit.

Maximum Seated Height: 1.75 mm

Low profile and compact size for fitting in space-constrained applications.

Width: 3.9 mm

Narrow width for efficient PCB layout and compact system designs.

Length: 8.65 mm

Optimal length for fitting on the PCB while maintaining a compact form factor.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability in vehicular applications.

Nominal Unity Gain Bandwidth: 5200 kHz

High unity gain bandwidth for versatile signal processing and amplification requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form for easy surface mounting and reliable solder connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier type for precision signal processing and amplification applications.

Maximum Supply Current: 2 mA

Low supply current requirement for improved power efficiency and reduced heat dissipation.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture for stable and accurate amplification of input signals.

Packing Method: TUBE

Tube packaging for secure storage and transport of the operational amplifiers.

Nominal Slow Rate: 1.6 V/us

Moderate slew rate for balanced response to input signal changes without sacrificing stability.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts and connector interfaces.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2463QD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

2200 uV

Minimum Voltage Gain:

28000

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Peak Bias Current:

75 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

2 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLV2463QD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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