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TLV2462QPWRG4

Texas Instruments

TLV2462QPWRG4 by Texas Instruments

TLV2462QPWRG4 by Texas Instruments is a CMOS Operational Amplifier with 2 functions, Vsup of +-1.35/+-3/2.7/6V, and 80dB Common Mode Reject Ratio. Ideal for automotive applications due to its low bias current, high voltage gain, and compact design in a small outline package.

Median Price

$2.111

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,950 parts In-Stock

1+ parts

$2.111

100+ parts

$1.850

1k+ parts

$1.045

10k+ parts

-

3,950

$2.111

$1.850

$1.045

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,005 parts In-Stock

1+ parts

$2.005

100+ parts

-

1k+ parts

-

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4,005

$2.005

-

-

-

Vyrian

USA . 4,236 parts In-Stock

1+ parts

-

100+ parts

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4,236

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,586 parts In-Stock

1+ parts

$1.900

100+ parts

-

1k+ parts

-

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1,586

$1.900

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-

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Parana Technologies

USA . 1,424 parts In-Stock

1+ parts

$5.316

100+ parts

-

1k+ parts

$5.959

10k+ parts

-

1,424

$5.316

-

$5.959

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DigiPath Technology Company

USA . 438 parts In-Stock

1+ parts

$5.854

100+ parts

-

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-

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438

$5.854

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ChromeModa Solutions

Germany . 6,229 parts In-Stock

1+ parts

$5.973

100+ parts

$4.898

1k+ parts

-

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6,229

$5.973

$4.898

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IDEA Electronic Components Group

UK . 724 parts In-Stock

1+ parts

$5.973

100+ parts

-

1k+ parts

$5.376

10k+ parts

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724

$5.973

-

$5.376

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AZTECH Wire

Italy . 770 parts In-Stock

1+ parts

$9.720

100+ parts

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770

$9.720

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Microchip USA

USA . 2,077 parts In-Stock

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2,077

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Overview

Unleash the power of precision with the TLV2462QPWRG4 by Texas Instruments. Crafted with excellence, this operational amplifier offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial settings, this compact and versatile device provides exceptional value with its low bias current and high common mode rejection ratio. Elevate your designs with the TLV2462QPWRG4 and experience the superior quality and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making this product suitable for a wide range of applications.

Maximum Input Offset Voltage: 2200 uV

Low input offset voltage ensures accurate signal processing and minimal errors in the output signal.

Maximum Average Bias Current (IIB): 0.075 uA

Low bias current reduces power consumption and ensures stable operation of the amplifier.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration of the amplifier into circuit boards, saving space and reducing assembly time.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio ensures that the amplifier can effectively reject common mode noise and interference for a clean output signal.

Operating Temperature: -40°C to 125°C

Wide operating temperature range makes this amplifier suitable for automotive applications where temperature fluctuations are common.

Nominal Unity Gain Bandwidth: 5200 kHz

High unity gain bandwidth allows for fast signal processing and wide frequency response, making this amplifier suitable for high-speed applications.

Technology: CMOS

CMOS technology provides low power consumption, high input impedance, and rail-to-rail output swing, making this amplifier energy-efficient and versatile.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2462QPWRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

71 dB

Input Offset Voltage Limit:

2200 uV

Minimum Voltage Gain:

31622

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Maximum Input Offset Current (IIO):

7 nA

Peak Bias Current:

75 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1.3 mA

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TLV2462QPWRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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