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TLV2462QDGKRQ1

Texas Instruments

TLV2462QDGKRQ1 by Texas Instruments

TLV2462QDGKRQ1 by Texas Instruments is a CMOS Operational Amplifier with 2000uV Max Input Offset Voltage, 85dB Nominal CMRR, and 6400kHz Unity Gain Bandwidth. Ideal for automotive applications due to AEC-Q100 screening level and low bias current of 0.000075uA.

Median Price

$2.076

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,950 parts In-Stock

1+ parts

$2.076

100+ parts

$1.715

1k+ parts

$0.927

10k+ parts

-

3,950

$2.076

$1.715

$0.927

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,286 parts In-Stock

1+ parts

$1.972

100+ parts

-

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3,286

$1.972

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Vyrian

USA . 8,136 parts In-Stock

1+ parts

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8,136

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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2,500

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Bristol Electronics

USA . 514 parts In-Stock

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514

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 328 parts In-Stock

1+ parts

$0.702

100+ parts

-

1k+ parts

$1.737

10k+ parts

-

328

$0.702

-

$1.737

-

DigiPath Technology Company

USA . 2,041 parts In-Stock

1+ parts

$0.773

100+ parts

$0.711

1k+ parts

-

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-

2,041

$0.773

$0.711

-

-

ChromeModa Solutions

Germany . 3,615 parts In-Stock

1+ parts

$0.789

100+ parts

$0.647

1k+ parts

-

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3,615

$0.789

$0.647

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IDEA Electronic Components Group

UK . 384 parts In-Stock

1+ parts

$0.789

100+ parts

-

1k+ parts

$0.710

10k+ parts

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384

$0.789

-

$0.710

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Corphita

USA . 4,786 parts In-Stock

1+ parts

$1.868

100+ parts

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4,786

$1.868

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AZTECH Wire

Italy . 1,055 parts In-Stock

1+ parts

$10.610

100+ parts

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1,055

$10.610

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A-Z Elektronik GmbH

Germany . 11,023 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Lixinc

USA . 3,207 parts In-Stock

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Perfect Parts

USA . 2,654 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Overview

Experience unrivaled performance and reliability with the TLV2462QDGKRQ1 Operational Amplifier by Texas Instruments. This cutting-edge device offers superior quality and precision, making it ideal for a wide range of automotive applications. With its advanced technology and high common mode rejection ratio, this op amp ensures optimal functionality and efficiency. Trust Texas Instruments to deliver innovative solutions that exceed expectations and provide unmatched value to customers seeking top-notch performance in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, suitable for various applications.

Maximum Input Offset Voltage: 2000 uV

The low maximum input offset voltage ensures minimal errors in the output signal, making the product accurate and reliable.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V is commonly used and readily available, making the product compatible with a wide range of power sources.

Frequency Compensation: YES

The frequency compensation feature helps maintain stability and prevent oscillations in the amplifier, ensuring consistent performance over a range of frequencies.

Technology: CMOS

The CMOS technology used in the amplifier results in low power consumption, high speed, and compatibility with digital circuits, making it efficient and versatile.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, the product is designed for high gain, accuracy, and stability, making it suitable for various signal processing applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2462QDGKRQ1 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

6.4 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Minimum Common Mode Rejection Ratio (CMRR ):

71 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

31622

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Maximum Input Offset Current (IIO):

7 nA

Peak Bias Current:

75 pA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

1.3 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold Silver

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

TLV2462QDGKRQ1 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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