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TLV2462IDG4

Texas Instruments

TLV2462IDG4 by Texas Instruments

TLV2462IDG4 by Texas Instruments is a CMOS Operational Amplifier with 2 functions, VOLTAGE-FEEDBACK architecture, and 80 dB Common Mode Reject Ratio. It operates at temperatures from -40 to 125 °C and has a Unity Gain Bandwidth of 5200 kHz. Ideal for automotive applications due to its low bias current and compact size.

Median Price

$2.950

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 434 parts In-Stock

1+ parts

$2.950

100+ parts

$2.160

1k+ parts

$1.840

10k+ parts

$1.420

434

$2.950

$2.160

$1.840

$1.420

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.780

100+ parts

-

1k+ parts

-

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50

$1.780

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-

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Digiode

USA . 2,002 parts In-Stock

1+ parts

$2.802

100+ parts

-

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-

2,002

$2.802

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Vyrian

USA . 7,632 parts In-Stock

1+ parts

-

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7,632

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 50 parts In-Stock

1+ parts

$1.744

100+ parts

-

1k+ parts

$1.675

10k+ parts

-

50

$1.744

-

$1.675

-

Ampacity Inc.

Singapore . 434 parts In-Stock

1+ parts

$2.510

100+ parts

-

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434

$2.510

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Corphita

USA . 3,566 parts In-Stock

1+ parts

$2.655

100+ parts

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3,566

$2.655

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Parana Technologies

USA . 1,768 parts In-Stock

1+ parts

$4.085

100+ parts

-

1k+ parts

$4.544

10k+ parts

-

1,768

$4.085

-

$4.544

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ChromeModa Solutions

Germany . 2,213 parts In-Stock

1+ parts

$4.590

100+ parts

$3.764

1k+ parts

-

10k+ parts

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2,213

$4.590

$3.764

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IDEA Electronic Components Group

UK . 644 parts In-Stock

1+ parts

$4.590

100+ parts

-

1k+ parts

$4.131

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644

$4.590

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$4.131

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AZTECH Wire

Italy . 336 parts In-Stock

1+ parts

$13.265

100+ parts

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336

$13.265

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Microchip USA

USA . 2,366 parts In-Stock

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2,366

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DigiPath Technology Company

USA . 356 parts In-Stock

1+ parts

-

100+ parts

$4.138

1k+ parts

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356

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$4.138

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Perfect Parts

USA . 168 parts In-Stock

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168

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Overview

Upgrade your electronics with the TLV2462IDG4 operational amplifier by Texas Instruments. Designed with precision and reliability in mind, this versatile component offers high performance in a compact package. Perfect for a wide range of applications, from audio equipment to sensor interfaces, this op amp delivers exceptional value and efficiency. Trust Texas Instruments to deliver quality products that enhance your projects with superior functionality and innovation. Experience the difference with the TLV2462IDG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and versatile material that can withstand various environmental conditions.

Maximum Input Offset Voltage: 2200 uV

Low input offset voltage ensures accurate signal processing.

Maximum Average Bias Current (IIB): 0.075 uA

Low bias current leads to minimal power consumption.

Surface Mount: YES

Easy to integrate onto circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Provides flexibility for different operational requirements.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio helps in rejecting noise and interference.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a low supply voltage.

Maximum Supply Voltage Limit: 6 V

Allows for a wide range of operating voltages for a variety of applications.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without degrading performance.

Frequency Compensation: YES

Ensures stability and prevents oscillations in the circuit.

Minimum Voltage Gain: 31622

Provides high amplification for weak input signals.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for signal processing and amplification applications.

Nominal Unity Gain Bandwidth: 5200 kHz

Provides a wide bandwidth for accurate signal reproduction.

Maximum Supply Current: 1.3 mA

Low supply current for reduced power consumption.

Terminal Form: GULL WING

Facilitates easy soldering and connection to the circuit board.

Packing Method: TUBE

Convenient packaging for storage and transportation.

Maximum Bias Current (IIB) @25°C: 0.014 uA

Ensures stable operation over a wide temperature range.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2462IDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

71 dB

Input Offset Voltage Limit:

2200 uV

Minimum Voltage Gain:

31622

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Maximum Input Offset Current (IIO):

7 nA

Peak Bias Current:

75 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1.3 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2462IDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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