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TLV2462CDG4

Texas Instruments

TLV2462CDG4 by Texas Instruments

TLV2462CDG4 by Texas Instruments is a dual operational amplifier with 2200uV max input offset voltage, 80dB CMRR, and 5200kHz unity gain bandwidth. Ideal for precision signal conditioning in commercial temperature applications.

Median Price

$2.810

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 267 parts In-Stock

1+ parts

$2.810

100+ parts

$2.060

1k+ parts

$1.750

10k+ parts

$1.350

267

$2.810

$2.060

$1.750

$1.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,316 parts In-Stock

1+ parts

$2.670

100+ parts

-

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-

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2,316

$2.670

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Vyrian

USA . 3,558 parts In-Stock

1+ parts

-

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3,558

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,248 parts In-Stock

1+ parts

$1.156

100+ parts

-

1k+ parts

$1.970

10k+ parts

-

1,248

$1.156

-

$1.970

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DigiPath Technology Company

USA . 1,747 parts In-Stock

1+ parts

$1.273

100+ parts

$1.171

1k+ parts

-

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1,747

$1.273

$1.171

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ChromeModa Solutions

Germany . 2,769 parts In-Stock

1+ parts

$1.299

100+ parts

$1.065

1k+ parts

-

10k+ parts

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2,769

$1.299

$1.065

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IDEA Electronic Components Group

UK . 1,019 parts In-Stock

1+ parts

$1.299

100+ parts

-

1k+ parts

$1.169

10k+ parts

-

1,019

$1.299

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$1.169

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Corphita

USA . 165 parts In-Stock

1+ parts

$2.529

100+ parts

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165

$2.529

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Component Stockers USA

USA . 361 parts In-Stock

1+ parts

$99.990

100+ parts

-

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361

$99.990

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Metaverse IC Inc.

Canada . 99,000 parts In-Stock

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99,000

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QUARKTWIN TECHNOLOGY LTD

USA . 21,474 parts In-Stock

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21,474

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Microchip USA

USA . 2,008 parts In-Stock

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2,008

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Overview

Enhance your electronic designs with the TLV2462CDG4 operational amplifier from Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable and efficient solutions for a variety of applications. With its compact package and low bias current, this op amp offers exceptional performance at a competitive price point. Trust in Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides good insulation and protection for the internal components of the op amp, ensuring reliability and longevity.

Maximum Input Offset Voltage: 2200 uV

Low input offset voltage ensures accurate signal processing and minimal error in the output signal.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and space in electronic devices.

Nominal Supply Voltage / Vsup (V): 3

Operates at a low nominal supply voltage, making it energy efficient and suitable for battery-powered devices.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making the op amp suitable for a wide range of applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2462CDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

71 dB

Input Offset Voltage Limit:

2200 uV

Minimum Voltage Gain:

31622

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Maximum Input Offset Current (IIO):

7 nA

Peak Bias Current:

25 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1.3 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2462CDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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