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TLV2461CDBVRG4

Texas Instruments

TLV2461CDBVRG4 by Texas Instruments

TLV2461CDBVRG4 by Texas Instruments is a CMOS Operational Amplifier with 2200uV Max Input Offset Voltage, 0.025uA Max Average Bias Current, and 80dB Nominal CMRR. Ideal for applications requiring low power consumption and high precision in a compact package.

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2

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1k+

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Vyrian

USA . 3,934 parts In-Stock

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Digiode

USA . 128 parts In-Stock

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One Stop Electronics

USA . 420 parts In-Stock

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$4.410

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Parana Technologies

USA . 657 parts In-Stock

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$5.839

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$6.623

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DigiPath Technology Company

USA . 622 parts In-Stock

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$6.430

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ChromeModa Solutions

Germany . 1,219 parts In-Stock

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IDEA Electronic Components Group

UK . 382 parts In-Stock

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$6.561

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$5.905

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AZTECH Wire

Italy . 556 parts In-Stock

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Component Stockers USA

USA . 625 parts In-Stock

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$99.990

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Kepictronics

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Corphita

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Overview

Unleash the power of precision with the TLV2461CDBVRG4 by Texas Instruments. Crafted with excellence, this operational amplifier delivers unparalleled performance in a compact package. From audio equipment to medical devices, this versatile component ensures reliable signal processing with minimal bias current and high common mode rejection ratio. Elevate your designs with the superior quality and advanced technology of Texas Instruments, where innovation meets value. Experience the difference with the TLV2461CDBVRG4 and unlock a world of possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 2200 uV

Low input offset voltage ensures accurate and stable amplification of signals.

Maximum Average Bias Current (IIB): 0.025 uA

Low bias current helps in minimizing errors and distortion in the amplified signal.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, ideal for compact designs.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio helps in reducing noise and interference in the signal.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level, suitable for many applications.

Power Supplies (V): +-1.35/+-3/2.7/6

Provides flexibility in power supply options, accommodating a range of voltage inputs.

No. of Terminals: 5

Simple and straightforward connectivity for easy integration into circuits.

Minimum Slew Rate: 0.8 V/us

Fast slew rate allows for quick response to input signal changes, enabling dynamic signal processing.

Max Supply Voltage Limit: 6 V

Operates within a safe voltage range for reliable performance and protection of the components.

Frequency Compensation: YES

Ensures stability and prevents oscillations in the amplifier circuit.

Nominal Unity Gain Bandwidth: 5200 kHz

High unity gain bandwidth allows for high-frequency signal amplification with minimal distortion.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance for efficient operation.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for precise amplification of analog signals with low distortion.

Maximum Supply Current: 0.65 mA

Low supply current consumption for energy-efficient operation.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2461CDBVRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

71 dB

Input Offset Voltage Limit:

2200 uV

Minimum Voltage Gain:

31622

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Maximum Input Offset Current (IIO):

7 nA

Peak Bias Current:

25 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

650 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV2461CDBVRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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