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TLV2460AQPW

Texas Instruments

TLV2460AQPW by Texas Instruments

TLV2460AQPW by Texas Instruments is an Operational Amplifier with 1700uV Max Input Offset Voltage, 80dB CMRR, and 5200kHz Unity Gain Bandwidth. Ideal for automotive applications due to its low bias current of 0.014uA @25C and compact size in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,947 parts In-Stock

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8,947

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Digiode

USA . 1,393 parts In-Stock

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1,393

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,345 parts In-Stock

1+ parts

$1.231

100+ parts

-

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$2.014

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2,345

$1.231

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$2.014

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ChromeModa Solutions

Germany . 2,124 parts In-Stock

1+ parts

$1.383

100+ parts

$1.134

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2,124

$1.383

$1.134

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IDEA Electronic Components Group

UK . 660 parts In-Stock

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$1.383

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$1.245

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660

$1.383

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$1.245

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One Stop Electronics

USA . 595 parts In-Stock

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$8.410

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595

$8.410

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AZTECH Wire

Italy . 193 parts In-Stock

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$13.305

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193

$13.305

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QUARKTWIN TECHNOLOGY LTD

USA . 24,270 parts In-Stock

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24,270

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Corphita

USA . 3,016 parts In-Stock

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3,016

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DigiPath Technology Company

USA . 1,099 parts In-Stock

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$1.247

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1,099

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$1.247

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Microchip USA

USA . 403 parts In-Stock

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403

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Overview

Enhance your circuit design with the Texas Instruments TLV2460AQPW operational amplifier. Known for their superior quality and reliable performance, Texas Instruments products are trusted by engineers worldwide. The TLV2460AQPW is ideal for a wide range of applications in industries such as automotive, consumer electronics, and telecommunications. With low power consumption and high precision, this operational amplifier offers exceptional value and unmatched benefits to customers seeking top-notch performance in their projects. Choose Texas Instruments for excellence in operational amplifiers and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 1700 uV

Low input offset voltage ensures accurate and precise operation of the amplifier.

Nominal Supply Voltage / Vsup (V): 3

Operates at a nominal supply voltage of 3V, making it suitable for low power applications.

Minimum Slew Rate: 0.9 V/us

Fast slew rate ensures rapid response to input signals, making it ideal for dynamic applications.

Nominal Unity Gain Bandwidth: 5200 kHz

High unity gain bandwidth allows for stable operation at high frequencies.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making it energy efficient and versatile.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2460AQPW attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

1700 uV

Minimum Voltage Gain:

28000

Minimum Slew Rate:

0.9 V/us

Nominal Slew Rate:

1.6 V/us

Peak Bias Current:

75 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

1 mA

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TLV2460AQPW Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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