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TLV2451CDG4

Texas Instruments

TLV2451CDG4 by Texas Instruments

TLV2451CDG4 by Texas Instruments is an Operational Amplifier with 2000uV Max Input Offset Voltage, 80dB Nominal CMRR, and 63095 Min Voltage Gain. Ideal for low-power applications in commercial temperature range with Vsup of +-3V. Package style is small outline, suitable for surface mount designs.

Median Price

$2.340

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 374 parts In-Stock

1+ parts

$2.340

100+ parts

$1.680

1k+ parts

$1.380

10k+ parts

$1.020

374

$2.340

$1.680

$1.380

$1.020

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,884 parts In-Stock

1+ parts

$2.223

100+ parts

-

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2,884

$2.223

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Vyrian

USA . 6,533 parts In-Stock

1+ parts

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6,533

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EMSNET

USA . 355 parts In-Stock

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355

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 326 parts In-Stock

1+ parts

$1.617

100+ parts

-

1k+ parts

$2.242

10k+ parts

-

326

$1.617

-

$2.242

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DigiPath Technology Company

USA . 330 parts In-Stock

1+ parts

$1.781

100+ parts

-

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330

$1.781

-

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ChromeModa Solutions

Germany . 1,732 parts In-Stock

1+ parts

$1.817

100+ parts

$1.490

1k+ parts

-

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1,732

$1.817

$1.490

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IDEA Electronic Components Group

UK . 933 parts In-Stock

1+ parts

$1.817

100+ parts

-

1k+ parts

$1.635

10k+ parts

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933

$1.817

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$1.635

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Corphita

USA . 872 parts In-Stock

1+ parts

$2.106

100+ parts

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872

$2.106

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Component Stockers USA

USA . 300 parts In-Stock

1+ parts

$99.990

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300

$99.990

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Microchip USA

USA . 1,469 parts In-Stock

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1,469

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Overview

Upgrade your electronic designs with the TLV2451CDG4 operational amplifier from Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable and efficient products that meet the demands of various applications. The TLV2451CDG4 offers customers exceptional value with its micropower technology, low bias currents, and high common mode rejection ratio. Whether you're working on sensor interfaces, precision instrumentation, or audio circuits, this operational amplifier provides the performance and precision you need to take your projects to the next level. Trust Texas Instruments to elevate your designs with the TLV2451CDG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the operational amplifier, making it suitable for a variety of applications.

Maximum Input Offset Voltage: 2000 uV

The low maximum input offset voltage ensures accurate and precise performance of the operational amplifier in signal processing applications.

Maximum Average Bias Current (IIB): 0.000007 uA

The extremely low bias current ensures minimal power consumption and stable operation of the operational amplifier.

Surface Mount: YES

The surface mount design allows for easy and convenient installation of the operational amplifier on circuit boards, saving space and reducing assembly time.

Nominal Common Mode Reject Ratio: 80 dB

The high common mode reject ratio ensures that unwanted common-mode signals are effectively rejected, improving the overall signal quality of the amplifier.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V makes this operational amplifier suitable for low power applications while maintaining reliable performance.

Power Supplies (V): +-1.35/+-3/2.7/6

With multiple power supply options, this operational amplifier can be easily integrated into different circuit configurations, offering flexibility in design.

No. of Terminals: 8

The 8-terminal configuration provides ample connection points for interfacing the operational amplifier with external components, enabling versatile circuit designs.

Maximum Input Offset Current (IIO): 0.00045 uA

The low input offset current ensures minimal error and distortion in signal processing applications, maximizing the accuracy of the operational amplifier.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards and allows for compact designs, making it ideal for applications with size constraints.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2451CDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

200 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

63095

Minimum Slew Rate:

0.02 V/us

Nominal Slew Rate:

0.11 V/us

Maximum Input Offset Current (IIO):

450 pA

Peak Bias Current:

7 pA

Maximum Bias Current (IIB) @25 °C:

5 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

42 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2451CDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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