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TLV2442AQPWRG4

Texas Instruments

TLV2442AQPWRG4 by Texas Instruments

TLV2442AQPWRG4 by Texas Instruments is a CMOS Operational Amplifier with 1600uV Max Input Offset Voltage, 75dB Nominal CMRR, and 1.3 V/us Min Slew Rate. Ideal for automotive applications due to its low-bias design and compact package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,583 parts In-Stock

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Digiode

USA . 3,634 parts In-Stock

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3,634

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One Stop Electronics

USA . 1,494 parts In-Stock

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$0.410

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$0.410

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Parana Technologies

USA . 1,612 parts In-Stock

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$4.325

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$4.746

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DigiPath Technology Company

USA . 1,954 parts In-Stock

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$4.762

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$4.381

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ChromeModa Solutions

Germany . 5,624 parts In-Stock

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$4.859

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$3.984

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$4.859

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IDEA Electronic Components Group

UK . 1,563 parts In-Stock

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$4.859

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$4.373

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AZTECH Wire

Italy . 674 parts In-Stock

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$8.358

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Component Stockers USA

USA . 570 parts In-Stock

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$99.990

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Corphita

USA . 4,389 parts In-Stock

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Microchip USA

USA . 1,689 parts In-Stock

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Kepictronics

USA . 1,050 parts In-Stock

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Overview

Discover the unparalleled performance and reliability of the TLV2442AQPWRG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality operational amplifiers that are ideal for a wide range of applications. With low bias current and high common mode rejection ratio, this compact and versatile Op Amp offers customers unmatched value and precision in their designs. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations and helps you achieve your goals with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a wide range of applications.

Maximum Input Offset Voltage: 1600 uV

Low input offset voltage ensures accuracy in signal processing and minimizes errors.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Nominal Common Mode Reject Ratio: 75 dB

High common mode rejection ratio helps in reducing unwanted noise and interference in the output signal.

Nominal Supply Voltage / Vsup (V): 3

Operates on a low supply voltage, making it suitable for low-power applications.

Frequency Compensation: YES

Frequency compensation ensures stability and performance of the operational amplifier over a wide range of frequencies.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, ideal for battery-powered devices.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for amplifying signals with high accuracy and low distortion.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2442AQPWRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±5/2.7/10 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.75 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

1600 uV

Minimum Voltage Gain:

400

Minimum Slew Rate:

0.4 V/us

Nominal Slew Rate:

1.3 V/us

Peak Bias Current:

260 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

12 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

2.2 mA

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TLV2442AQPWRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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