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TLV2401ID

Texas Instruments

TLV2401ID by Texas Instruments

OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$1.608

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 78 parts In-Stock

1+ parts

$0.296

100+ parts

-

1k+ parts

-

10k+ parts

-

78

$0.296

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-

-

Texas Instruments

USA . 7,850 parts In-Stock

1+ parts

$2.240

100+ parts

$1.723

1k+ parts

$0.907

10k+ parts

-

7,850

$2.240

$1.723

$0.907

-

Rochester

USA . 21,503 parts In-Stock

1+ parts

-

100+ parts

$1.540

1k+ parts

$1.280

10k+ parts

$1.140

21,503

-

$1.540

$1.280

$1.140

DigiKey

USA . 21,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.930

10k+ parts

-

21,503

-

-

$1.930

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Verical

USA . 16,703 parts In-Stock

1+ parts

-

100+ parts

-

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$1.600

10k+ parts

$1.425

16,703

-

-

$1.600

$1.425

Chip1Stop

Japan . 600 parts In-Stock

1+ parts

-

100+ parts

$1.616

1k+ parts

$1.354

10k+ parts

-

600

-

$1.616

$1.354

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Avnet

USA . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.096

10k+ parts

$1.030

40

-

-

$1.096

$1.030

RS (Exports)

UK . 5 parts In-Stock

1+ parts

-

100+ parts

$1.788

1k+ parts

-

10k+ parts

-

5

-

$1.788

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 352 parts In-Stock

1+ parts

$1.197

100+ parts

-

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352

$1.197

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Vyrian

USA . 3,611 parts In-Stock

1+ parts

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3,611

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LittleDiode

UK . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,465 parts In-Stock

1+ parts

$1.134

100+ parts

-

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2,465

$1.134

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Parana Technologies

USA . 504 parts In-Stock

1+ parts

$4.219

100+ parts

-

1k+ parts

$4.655

10k+ parts

-

504

$4.219

-

$4.655

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ChromeModa Solutions

Germany . 5,831 parts In-Stock

1+ parts

$4.741

100+ parts

$3.888

1k+ parts

-

10k+ parts

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5,831

$4.741

$3.888

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IDEA Electronic Components Group

UK . 1,243 parts In-Stock

1+ parts

$4.741

100+ parts

-

1k+ parts

$4.267

10k+ parts

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1,243

$4.741

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$4.267

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A-Z Elektronik GmbH

Germany . 1,203 parts In-Stock

1+ parts

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1,203

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DigiPath Technology Company

USA . 54 parts In-Stock

1+ parts

-

100+ parts

$4.274

1k+ parts

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10k+ parts

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54

-

$4.274

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-

Technical Specifications

Operational Amplifiers (Op Amps) TLV2401ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.25/±8/2.5/16 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.5 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

120 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

1500 uV

Minimum Voltage Gain:

130000

Nominal Slew Rate:

2500 V/us

Maximum Input Offset Current (IIO):

250 pA

Peak Bias Current:

900 pA

Maximum Bias Current (IIB) @25 °C:

300 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

17 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

950 nA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2401ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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