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TLV2371MDBVREP

Texas Instruments

TLV2371MDBVREP by Texas Instruments

TLV2371MDBVREP by Texas Instruments is an Operational Amplifier with 6000uV Max Input Offset Voltage, 80dB Nominal CMRR, and 1 V/us Min Slew Rate. Ideal for military applications due to -55 to 125 °C operating temp range and low bias current of 0.00006uA.

Median Price

$2.613

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

USA . 8,616 parts In-Stock

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Digiode

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Cyclops Electronics Ltd

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Component Sense

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LIBRA Elektronik GmbH

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Corohmni

South Africa . 168 parts In-Stock

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$1.589

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Continental Prestige Electronics

USA . 5,157 parts In-Stock

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$2.561

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Argo Parts USA

USA . 4,708 parts In-Stock

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Semicontronic

India . 564 parts In-Stock

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$4.410

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$4.300

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$4.278

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Parana Technologies

USA . 1,140 parts In-Stock

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$4.672

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$5.154

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DigiPath Technology Company

USA . 1,601 parts In-Stock

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ChromeModa Solutions

Germany . 5,390 parts In-Stock

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IDEA Electronic Components Group

UK . 474 parts In-Stock

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One Stop Electronics

USA . 343 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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AZTECH Wire

Italy . 878 parts In-Stock

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Ampacity Inc.

Singapore . 815 parts In-Stock

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Microchip USA

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A-Z Elektronik GmbH

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Overview

Elevate your electronic designs with the TLV2371MDBVREP operational amplifier by Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable and efficient products that exceed industry standards. This operational amplifier is ideal for a wide range of applications, offering customers exceptional value and performance. Whether you're designing audio equipment, sensor interfaces, or precision instrumentation, this op amp provides the precision and reliability you need to bring your projects to life. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 6000 uV

Low input offset voltage ensures accuracy and precision in signal processing applications.

Surface Mount: YES

Enables easy and efficient integration onto PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 2.7

Operates efficiently at a low nominal supply voltage, making it suitable for low power applications.

Minimum Slew Rate: 1 V/us

Provides fast response time for quick signal processing and improved performance.

Maximum Supply Voltage Limit: 16.5 V

Wide supply voltage range allows for flexibility in different operating conditions.

Frequency Compensation: YES

Ensures stability and prevents oscillations in the amplifier circuit.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high input impedance, ideal for battery-powered devices.

Maximum Supply Current: 0.66 mA

Low supply current consumption for energy efficiency.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2371MDBVREP attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±8/2.7/16 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

55 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

56234

Minimum Slew Rate:

1 V/us

Nominal Slew Rate:

2.4 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

16.5 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

660 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV2371MDBVREP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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