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TLV2371IDG4

Texas Instruments

TLV2371IDG4 by Texas Instruments

TLV2371IDG4 by Texas Instruments is an Operational Amplifier with 6000uV Max Input Offset Voltage, 72dB CMRR, and 3000kHz Unity Gain Bandwidth. Widely used in automotive applications due to its low-bias current, VOLTAGE-FEEDBACK architecture, and wideband technology.

Median Price

$0.895

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 81 parts In-Stock

1+ parts

$0.895

100+ parts

-

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81

$0.895

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Vyrian

USA . 4,268 parts In-Stock

1+ parts

-

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4,268

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Digiode

USA . 1,096 parts In-Stock

1+ parts

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1,096

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,169 parts In-Stock

1+ parts

$0.410

100+ parts

-

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1,169

$0.410

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Continental Prestige Electronics

USA . 5,774 parts In-Stock

1+ parts

$0.895

100+ parts

-

1k+ parts

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10k+ parts

$0.877

5,774

$0.895

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-

$0.877

Argo Parts USA

USA . 1,573 parts In-Stock

1+ parts

$0.895

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1,573

$0.895

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$0.895

100+ parts

$0.850

1k+ parts

$0.808

10k+ parts

$0.797

100

$0.895

$0.850

$0.808

$0.797

Ampacity Inc.

Singapore . 684 parts In-Stock

1+ parts

$2.410

100+ parts

-

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684

$2.410

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Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

$5.087

100+ parts

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1k+ parts

$5.665

10k+ parts

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1,380

$5.087

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$5.665

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IDEA Electronic Components Group

UK . 2,102 parts In-Stock

1+ parts

$5.716

100+ parts

-

1k+ parts

$5.144

10k+ parts

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2,102

$5.716

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$5.144

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ChromeModa Solutions

Germany . 1,410 parts In-Stock

1+ parts

$5.716

100+ parts

$4.687

1k+ parts

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1,410

$5.716

$4.687

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AZTECH Wire

Italy . 415 parts In-Stock

1+ parts

$14.118

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415

$14.118

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Corphita

USA . 3,831 parts In-Stock

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3,831

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Microchip USA

USA . 2,332 parts In-Stock

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2,332

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DigiPath Technology Company

USA . 1,436 parts In-Stock

1+ parts

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100+ parts

$5.154

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1,436

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$5.154

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Overview

Discover the superior performance and reliability of the TLV2371IDG4 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. As part of the Operational Amplifiers category, this product offers unparalleled precision and efficiency for a wide range of applications. With a focus on quality and innovation, Texas Instruments delivers a product that guarantees value and benefits to customers, making it an essential component for any project requiring exceptional performance. Choose Texas Instruments for trusted quality and unmatched results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to external elements, making the op amp suitable for a variety of environments.

Maximum Input Offset Voltage: 6000 uV

Low input offset voltage ensures accurate signal processing and minimizes errors in the output.

Nominal Supply Voltage / Vsup (V): 5

Operates on a typical supply voltage of 5V, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

Operates efficiently at high temperatures, making it suitable for industrial and automotive applications where heat can be a concern.

Width: 3.9 mm

Compact design allows for easy integration into space-constrained systems or PCB layouts.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it ideal for battery-powered devices or sensitive applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Tailored specifically for amplification purposes, ensuring high performance and reliable signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2371IDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±8/2.7/16 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

72 dB

Minimum Common Mode Rejection Ratio (CMRR ):

55 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

79432

Minimum Slew Rate:

1 V/us

Nominal Slew Rate:

2.4 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

16.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

660 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2371IDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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