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TLV2362IDGKR

Texas Instruments

TLV2362IDGKR by Texas Instruments

TLV2362IDGKR by Texas Instruments is a dual operational amplifier with 7500uV max input offset voltage, 0.25uA max average bias current, and 75dB nominal CMRR. Ideal for industrial applications requiring high voltage gain, low bias current, and precise signal amplification in a compact package.

Median Price

$0.531

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 84,470 parts In-Stock

1+ parts

$0.669

100+ parts

$0.515

1k+ parts

$0.271

10k+ parts

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84,470

$0.669

$0.515

$0.271

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DigiKey

USA . 2,500 parts In-Stock

1+ parts

-

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$0.440

2,500

-

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-

$0.440

Rochester

USA . 280 parts In-Stock

1+ parts

-

100+ parts

$0.531

1k+ parts

$0.441

10k+ parts

$0.393

280

-

$0.531

$0.441

$0.393

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,469 parts In-Stock

1+ parts

$0.357

100+ parts

-

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2,469

$0.357

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Chip Stock

USA . 8,500 parts In-Stock

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8,500

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Vyrian

USA . 5,989 parts In-Stock

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5,989

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Prism Electronics

USA . 570 parts In-Stock

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570

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SPM Sales

USA . 395 parts In-Stock

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395

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,475 parts In-Stock

1+ parts

$0.338

100+ parts

-

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-

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4,475

$0.338

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Parana Technologies

USA . 915 parts In-Stock

1+ parts

$5.215

100+ parts

-

1k+ parts

$5.828

10k+ parts

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915

$5.215

-

$5.828

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DigiPath Technology Company

USA . 1,629 parts In-Stock

1+ parts

$5.743

100+ parts

$5.283

1k+ parts

-

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1,629

$5.743

$5.283

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ChromeModa Solutions

Germany . 4,826 parts In-Stock

1+ parts

$5.860

100+ parts

$4.805

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4,826

$5.860

$4.805

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IDEA Electronic Components Group

UK . 65 parts In-Stock

1+ parts

$5.860

100+ parts

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$5.274

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65

$5.860

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$5.274

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AZTECH Wire

Italy . 613 parts In-Stock

1+ parts

$18.920

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613

$18.920

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 14,145 parts In-Stock

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Lixinc

USA . 11,866 parts In-Stock

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Perfect Parts

USA . 8,044 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Enhance your electronic designs with the TLV2362IDGKR operational amplifier from Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers a wide range of applications for their operational amplifiers including signal processing, audio amplification, and sensor interfacing. With low input offset voltage and current, as well as high common mode rejection ratio, this versatile component provides exceptional performance in industrial settings. Trust Texas Instruments to deliver cutting-edge technology and unmatched value with the TLV2362IDGKR operational amplifier.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the operational amplifier, ensuring long-term reliability.

Maximum Input Offset Voltage: 7500 uV

Low input offset voltage allows for accurate signal processing and minimal distortion in the output signal.

Maximum Average Bias Current (IIB): 0.25 uA

Low bias current helps in maintaining stable operation and minimizing power consumption.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration into circuit boards.

Nominal Supply Voltage / Vsup (V): 1.5

Low nominal supply voltage enables efficient power usage and compatibility with a wide range of applications.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise operation, making this operational amplifier ideal for sensitive applications.

Nominal Unity Gain Bandwidth: 6000 kHz

High unity gain bandwidth ensures fast and accurate signal processing, suitable for a variety of high-speed applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2362IDGKR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.5/±2.5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

6 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

75 dB

Minimum Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

7500 uV

Minimum Voltage Gain:

1000

Nominal Slew Rate:

2.5 V/us

Maximum Input Offset Current (IIO):

100 nA

Peak Bias Current:

250 nA

Maximum Bias Current (IIB) @25 °C:

150 nA

Operational Characteristics

Nominal Supply Voltage:

1.5 V

Maximum Supply Voltage:

3.5 V

Maximum Negative Supply Voltage:

-1.5 V

Minimum Negative Supply Voltage:

-3.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

5 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

TLV2362IDGKR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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