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TLV2361CDBVTG4

Texas Instruments

TLV2361CDBVTG4 by Texas Instruments

TLV2361CDBVTG4 by Texas Instruments is a 5-terminal Op Amp with 7500uV Max Input Offset Voltage, 75dB CMRR, and 6000kHz Unity Gain Bandwidth. Ideal for commercial applications requiring low power consumption and high precision in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,285 parts In-Stock

1+ parts

-

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6,285

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Digiode

USA . 3,027 parts In-Stock

1+ parts

-

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-

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3,027

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,170 parts In-Stock

1+ parts

$2.156

100+ parts

-

1k+ parts

$2.669

10k+ parts

-

2,170

$2.156

-

$2.669

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ChromeModa Solutions

Germany . 1,022 parts In-Stock

1+ parts

$2.423

100+ parts

$1.987

1k+ parts

-

10k+ parts

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1,022

$2.423

$1.987

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IDEA Electronic Components Group

UK . 325 parts In-Stock

1+ parts

$2.423

100+ parts

-

1k+ parts

$2.181

10k+ parts

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325

$2.423

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$2.181

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One Stop Electronics

USA . 595 parts In-Stock

1+ parts

$3.410

100+ parts

-

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10k+ parts

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595

$3.410

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-

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AZTECH Wire

Italy . 252 parts In-Stock

1+ parts

$14.514

100+ parts

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252

$14.514

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Corphita

USA . 4,867 parts In-Stock

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4,867

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DigiPath Technology Company

USA . 421 parts In-Stock

1+ parts

-

100+ parts

$2.185

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421

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$2.185

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Microchip USA

USA . 288 parts In-Stock

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288

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Overview

Discover the power and precision of the TLV2361CDBVTG4 by Texas Instruments. This operational amplifier is a game-changer in its category, offering unmatched quality and reliability. Perfect for a wide range of applications, this amplifier provides exceptional performance while maintaining a compact and efficient design. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Upgrade your projects with the TLV2361CDBVTG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier, ensuring long-term reliability.

Maximum Input Offset Voltage: 7500 uV

Low input offset voltage ensures accurate signal processing and minimal distortion in the output signal.

Nominal Supply Voltage / Vsup (V): 1.5

Operates at a low supply voltage, making it suitable for low-power applications and reducing power consumption.

Frequency Compensation: YES

Provides stability and prevents oscillations in the circuit, ensuring reliable operation in various conditions.

Nominal Unity Gain Bandwidth: 6000 kHz

High unity gain bandwidth allows for amplification of wideband signals with minimal distortion.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2361CDBVTG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.5/±2.5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

6 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

7500 uV

Nominal Slew Rate:

2.5 V/us

Peak Bias Current:

250 nA

Operational Characteristics

Nominal Supply Voltage:

1.5 V

Maximum Supply Voltage:

3.5 V

Maximum Negative Supply Voltage:

-1.5 V

Minimum Negative Supply Voltage:

-3.5 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV2361CDBVTG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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