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TLV2264IDG4

Texas Instruments

TLV2264IDG4 by Texas Instruments

TLV2264IDG4 by Texas Instruments is a CMOS Operational Amplifier with 3000uV Max Input Offset Voltage, 75dB Nominal CMRR, and 670kHz Unity Gain Bandwidth. Ideal for automotive applications due to its low-bias, micropower design and VOLTAGE-FEEDBACK architecture.

Median Price

$1.650

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$1.650

1k+ parts

$1.480

10k+ parts

$1.390

7

-

$1.650

$1.480

$1.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 250 parts In-Stock

1+ parts

$1.872

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$1.872

-

-

-

Vyrian

USA . 7,309 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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7,309

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,687 parts In-Stock

1+ parts

$1.773

100+ parts

-

1k+ parts

-

10k+ parts

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2,687

$1.773

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-

-

Component Stockers USA

USA . 9 parts In-Stock

1+ parts

$2.040

100+ parts

-

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9

$2.040

-

-

-

Parana Technologies

USA . 165 parts In-Stock

1+ parts

$3.925

100+ parts

-

1k+ parts

$4.397

10k+ parts

-

165

$3.925

-

$4.397

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DigiPath Technology Company

USA . 1,401 parts In-Stock

1+ parts

$4.322

100+ parts

$3.976

1k+ parts

-

10k+ parts

-

1,401

$4.322

$3.976

-

-

ChromeModa Solutions

Germany . 2,101 parts In-Stock

1+ parts

$4.410

100+ parts

$3.616

1k+ parts

-

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2,101

$4.410

$3.616

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IDEA Electronic Components Group

UK . 1,055 parts In-Stock

1+ parts

$4.410

100+ parts

-

1k+ parts

$3.969

10k+ parts

-

1,055

$4.410

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$3.969

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AZTECH Wire

Italy . 1,139 parts In-Stock

1+ parts

$10.870

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1,139

$10.870

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Microchip USA

USA . 932 parts In-Stock

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932

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Overview

Experience top-notch performance and reliability with the TLV2264IDG4 operational amplifier from Texas Instruments. This versatile component offers unparalleled precision and efficiency, making it ideal for a wide range of applications. From automotive to industrial settings, this small outline package delivers exceptional results with low bias current and micropower technology. Trust Texas Instruments to provide you with the quality and value you need for your projects. Elevate your designs with the TLV2264IDG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the op amp, ensuring long-term reliability in various operating conditions.

Maximum Input Offset Voltage: 3000 uV

Low input offset voltage helps in minimizing errors in signal processing applications, making this op amp suitable for precision measurement and instrumentation tasks.

No. of Functions: 4

The op amp offers multiple functions in a single package, allowing for versatility in circuit design and potentially reducing the need for additional components.

Nominal Common Mode Reject Ratio: 75 dB

High common mode rejection ratio ensures that the op amp effectively rejects common-mode noise, resulting in cleaner and more accurate signal processing.

Nominal Supply Voltage / Vsup (V): 3

Low supply voltage requirements make this op amp suitable for battery-powered or low-power applications, helping to conserve energy and extend battery life.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making this op amp ideal for applications where power efficiency and high input impedance are important.

Nominal Unity Gain Bandwidth: 670 kHz

High unity gain bandwidth provides high-frequency response, making this op amp suitable for applications requiring fast signal processing and amplification at high frequencies.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2264IDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±4/2.7/8 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

670 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

75 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

3000 uV

Minimum Voltage Gain:

55000

Minimum Slew Rate:

0.3 V/us

Nominal Slew Rate:

0.55 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

800 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

16 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLV2264IDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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