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TLV2264AQDR

Texas Instruments

TLV2264AQDR by Texas Instruments

TLV2264AQDR by Texas Instruments is a CMOS Operational Amplifier with 1500uV Max Input Offset Voltage, 77dB Nominal CMRR, and 670kHz Unity Gain Bandwidth. Ideal for automotive applications due to its low-bias, micropower design and wide temperature range of -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,114 parts In-Stock

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8,114

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Digiode

USA . 4,160 parts In-Stock

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4,160

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 615 parts In-Stock

1+ parts

$0.410

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615

$0.410

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Parana Technologies

USA . 1,059 parts In-Stock

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$0.746

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$1.753

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1,059

$0.746

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$1.753

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DigiPath Technology Company

USA . 1,589 parts In-Stock

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$0.821

100+ parts

$0.756

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1,589

$0.821

$0.756

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ChromeModa Solutions

Germany . 6,647 parts In-Stock

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$0.838

100+ parts

$0.687

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6,647

$0.838

$0.687

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IDEA Electronic Components Group

UK . 2,103 parts In-Stock

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$0.838

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$0.754

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2,103

$0.838

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$0.754

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AZTECH Wire

Italy . 547 parts In-Stock

1+ parts

$5.334

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547

$5.334

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Corphita

USA . 3,011 parts In-Stock

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Microchip USA

USA . 106 parts In-Stock

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Overview

Enhance your electronic designs with the TLV2264AQDR by Texas Instruments, a top-notch operational amplifier that guarantees superior performance and reliability. Manufactured by the trusted brand Texas Instruments, this op amp is perfect for a wide range of applications, from industrial automation to consumer electronics. With its low power consumption and high voltage supply capabilities, the TLV2264AQDR provides exceptional value and efficiency to customers looking to optimize their circuits. Upgrade your projects with the TLV2264AQDR today and experience unparalleled quality and precision like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and ensures the product's longevity.

Maximum Input Offset Voltage: 1500 uV

Low input offset voltage ensures accurate signal processing.

Maximum Average Bias Current (IIB): 0.0008 uA

Low bias current minimizes power consumption and improves efficiency.

Surface Mount: YES

Surface mount capability makes it easy to integrate into circuit boards.

Nominal Common Mode Reject Ratio: 77 dB

High common mode rejection ratio ensures reliable performance in noisy environments.

Nominal Supply Voltage / Vsup (V): 3

Compatible with a wide range of supply voltages for flexibility in design.

Minimum Slew Rate: 0.25 V/us

High slew rate allows for fast response to input signals.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes it suitable for various applications.

Frequency Compensation: YES

Frequency compensation ensures stability in the amplifier's performance.

Minimum Voltage Gain: 25000

High voltage gain for amplifying weak signals with accuracy.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile and commonly used in various electronic circuits.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2264AQDR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±4/2.7/8 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

670 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

77 dB

Input Offset Voltage Limit:

1500 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

0.25 V/us

Nominal Slew Rate:

0.55 V/us

Peak Bias Current:

800 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

16 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

1 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLV2264AQDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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