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TLV2262QDG4

Texas Instruments

TLV2262QDG4 by Texas Instruments

TLV2262QDG4 by Texas Instruments is a dual operational amplifier with low bias current (0.0008 uA) and high voltage gain (25000). Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C and has a unity gain bandwidth of 670 kHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,851 parts In-Stock

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5,851

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Digiode

USA . 624 parts In-Stock

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One Stop Electronics

USA . 552 parts In-Stock

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$4.410

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552

$4.410

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Parana Technologies

USA . 161 parts In-Stock

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$6.140

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$6.910

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161

$6.140

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$6.910

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ChromeModa Solutions

Germany . 4,200 parts In-Stock

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$6.899

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$5.657

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$6.899

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IDEA Electronic Components Group

UK . 1,982 parts In-Stock

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$6.899

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$6.209

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1,982

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AZTECH Wire

Italy . 573 parts In-Stock

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$15.343

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Microchip USA

USA . 2,497 parts In-Stock

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Corphita

USA . 2,025 parts In-Stock

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DigiPath Technology Company

USA . 260 parts In-Stock

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$6.220

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$6.220

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Overview

Experience superior performance and efficiency with the TLV2262QDG4 operational amplifiers from Texas Instruments. Designed with precision and reliability in mind, these op amps are perfect for a wide range of applications, delivering unparalleled quality and accuracy. With low bias currents and micropower capabilities, these devices offer unmatched value and benefits to customers looking for high-performance solutions. Trust in Texas Instruments to provide you with the tools you need to succeed in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Maximum Input Offset Voltage: 3000 uV

Low input offset voltage ensures accuracy in signal amplification and processing.

Maximum Average Bias Current (IIB): 0.0008 uA

Low bias current helps in minimizing power consumption and improving efficiency.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB mounting.

Nominal Common Mode Reject Ratio: 75 dB

High common mode rejection ratio helps in reducing noise and interference in the signal.

Nominal Supply Voltage / Vsup (V): 3

Operates at a common voltage level of 3V, making it suitable for low power applications.

Minimum Slew Rate: 0.25 V/us

Fast slew rate ensures rapid response to input signal changes, suitable for dynamic applications.

Frequency Compensation: YES

Frequency compensation improves stability and performance of the amplifier at various frequencies.

Minimum Voltage Gain: 25000

High voltage gain allows for amplification of weak signals with minimal distortion.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, enhancing performance.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2262QDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

670 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

3000 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

0.25 V/us

Nominal Slew Rate:

0.55 V/us

Peak Bias Current:

800 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

16 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

500 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2262QDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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