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TLV2262MJGB

Texas Instruments

TLV2262MJGB by Texas Instruments

TLV2262MJGB by Texas Instruments is a dual operational amplifier with low bias current (0.00006 uA) and micropower technology. It operates at a wide temperature range (-55 to 125 °C) and has a high common mode reject ratio (83 dB). Ideal for military applications requiring precision amplification in compact spaces.

Median Price

$29.729

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,782 parts In-Stock

1+ parts

$29.156

100+ parts

$25.468

1k+ parts

$17.564

10k+ parts

-

1,782

$29.156

$25.468

$17.564

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Arrow

USA . 22 parts In-Stock

1+ parts

$30.302

100+ parts

$28.393

1k+ parts

$27.611

10k+ parts

-

22

$30.302

$28.393

$27.611

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,240 parts In-Stock

1+ parts

$27.698

100+ parts

-

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-

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3,240

$27.698

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Vyrian

USA . 3,243 parts In-Stock

1+ parts

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3,243

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,568 parts In-Stock

1+ parts

$1.377

100+ parts

$127.860

1k+ parts

$1.239

10k+ parts

-

1,568

$1.377

$127.860

$1.239

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DigiPath Technology Company

USA . 1,124 parts In-Stock

1+ parts

$1.516

100+ parts

-

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-

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1,124

$1.516

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-

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ChromeModa Solutions

Germany . 4,529 parts In-Stock

1+ parts

$1.547

100+ parts

$1.269

1k+ parts

-

10k+ parts

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4,529

$1.547

$1.269

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-

IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$1.547

100+ parts

-

1k+ parts

$1.392

10k+ parts

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961

$1.547

-

$1.392

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AZTECH Wire

Italy . 305 parts In-Stock

1+ parts

$16.980

100+ parts

-

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305

$16.980

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Corphita

USA . 126 parts In-Stock

1+ parts

$26.240

100+ parts

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126

$26.240

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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Microchip USA

USA . 1,929 parts In-Stock

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1,929

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Perfect Parts

USA . 12 parts In-Stock

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12

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Overview

Enhance your electronic designs with the high-quality TLV2262MJGB operational amplifier from Texas Instruments. Crafted with precision and reliability in mind, this op amp offers exceptional performance and functionality for a wide range of applications. Whether you're working on audio equipment, sensor interfaces, or control systems, this versatile component delivers superior value and benefits to meet your needs. Trust in Texas Instruments to provide cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent protection for the internal components of the operational amplifier, ensuring long-term reliability and stability.

Maximum Input Offset Voltage: 2500 uV

Low input offset voltage helps in minimizing errors in the output signal, making this operational amplifier suitable for precision applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs and PCB layouts, optimizing space efficiency.

Nominal Common Mode Reject Ratio: 83 dB

High common mode rejection ratio ensures that the amplifier can effectively reject noise and interference from the input signal, resulting in a clean output.

Frequency Compensation: YES

Frequency compensation ensures stability and prevents oscillations, making this operational amplifier suitable for a wide range of applications.

Nominal Unity Gain Bandwidth: 710 kHz

High unity gain bandwidth allows for high-frequency operation, making this operational amplifier ideal for applications requiring fast response times.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides excellent linearity and stability, making this operational amplifier a reliable choice for precision circuits.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliable operation in harsh environmental conditions, making this operational amplifier suitable for demanding applications.

Low-Bias: YES

Low bias current ensures minimal power consumption and low input offset currents, making this operational amplifier energy-efficient and accurate.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2262MJGB attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±4/2.7/8 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

710 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

83 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

2500 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

0.25 V/us

Nominal Slew Rate:

0.55 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

800 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

16 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

500 μA

Physical Characteristics

Length:

0.377 in (9.58 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin/Lead

Package Body Material:

Ceramic, Glass-Sealed

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883

Standards

JESD-30 Code:

R-GDIP-T8

JESD-609 Code:

e0

Packaging and Shipping

Packing Method:

Tube

Package Code:

DIP

Package Shape:

Package Style:

In Line

Package Equivalence Code:

DIP8,.3

Trade Compliance

TLV2262MJGB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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