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TLV2262AMUB

Texas Instruments

TLV2262AMUB by Texas Instruments

TLV2262AMUB by Texas Instruments is a dual operational amplifier with 950uV max input offset voltage, 0.0008uA max average bias current, and 83dB nominal CMRR. Ideal for military applications due to MIL-STD-883 screening level, it offers low-bias operation and micropower technology in a compact flatpack package.

Median Price

$37.623

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,067 parts In-Stock

1+ parts

$37.623

100+ parts

$33.442

1k+ parts

$24.590

10k+ parts

-

1,067

$37.623

$33.442

$24.590

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,055 parts In-Stock

1+ parts

$35.742

100+ parts

-

1k+ parts

-

10k+ parts

-

3,055

$35.742

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-

-

Vyrian

USA . 3,336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,336

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 962 parts In-Stock

1+ parts

$2.901

100+ parts

$269.439

1k+ parts

$2.611

10k+ parts

-

962

$2.901

$269.439

$2.611

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DigiPath Technology Company

USA . 2,108 parts In-Stock

1+ parts

$3.195

100+ parts

-

1k+ parts

-

10k+ parts

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2,108

$3.195

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-

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ChromeModa Solutions

Germany . 4,287 parts In-Stock

1+ parts

$3.260

100+ parts

$2.673

1k+ parts

-

10k+ parts

-

4,287

$3.260

$2.673

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-

IDEA Electronic Components Group

UK . 834 parts In-Stock

1+ parts

$3.260

100+ parts

-

1k+ parts

$2.934

10k+ parts

-

834

$3.260

-

$2.934

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AZTECH Wire

Italy . 586 parts In-Stock

1+ parts

$21.390

100+ parts

-

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586

$21.390

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Corphita

USA . 2,066 parts In-Stock

1+ parts

$33.861

100+ parts

-

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-

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2,066

$33.861

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-

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Microchip USA

USA . 1,641 parts In-Stock

1+ parts

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1,641

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Overview

Elevate your projects with the TLV2262AMUB by Texas Instruments, a top-quality operational amplifier that delivers exceptional performance in a compact package. Manufactured with precision and reliability in mind, this op amp is ideal for a wide range of applications. From audio equipment to sensor interfaces, this product offers unparalleled value and benefits to customers seeking superior signal processing capabilities. Trust in Texas Instruments to provide innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package provides durability and protection for the internal components of the operational amplifier, ensuring reliable performance in various operating conditions.

Maximum Input Offset Voltage: 950 uV

The low maximum input offset voltage of 950 uV helps in minimizing errors in the output signal, making this operational amplifier suitable for precision applications.

Surface Mount: YES

The surface mount capability allows for easy integration of the operational amplifier onto a printed circuit board, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3

The low nominal supply voltage of 3V makes this operational amplifier energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this operational amplifier can withstand elevated temperatures without compromising its performance, ideal for harsh environments.

Technology: CMOS

The CMOS technology used in this operational amplifier ensures low power consumption and high reliability, making it a cost-effective and efficient choice for various applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2262AMUB attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±4/2.7/8 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

710 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

83 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

950 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

0.25 V/us

Nominal Slew Rate:

0.55 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

800 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

16 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

500 μA

Physical Characteristics

Length:

0.255 in (6.475 mm)

Width:

0.245 in (6.225 mm)

Maximum Seated Height:

0.08 in (2.03 mm)

Total Terminals:

10

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Ceramic, Glass-Sealed

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883

Standards

JESD-30 Code:

R-GDFP-F10

JESD-609 Code:

e0

Packaging and Shipping

Packing Method:

Tube

Package Code:

DFP

Package Shape:

Package Style:

Flatpack

Package Equivalence Code:

FL10,.24

Trade Compliance

TLV2262AMUB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

NSN

5962-01-629-1957, 5962016291957

NIIN

016291957

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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