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TLV2252QDREP

Texas Instruments

TLV2252QDREP by Texas Instruments

TLV2252QDREP by Texas Instruments is a dual operational amplifier with 1750uV max input offset voltage, 75dB CMRR, and 10000 min voltage gain. Ideal for automotive applications due to its low-bias, micropower technology, and VFB architecture. Package style: SOIC-8.

Median Price

$5.315

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 33 parts In-Stock

1+ parts

$5.315

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33

$5.315

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Vyrian

USA . 6,063 parts In-Stock

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6,063

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Digiode

USA . 436 parts In-Stock

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436

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 287 parts In-Stock

1+ parts

$0.882

100+ parts

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$1.820

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287

$0.882

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$1.820

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DigiPath Technology Company

USA . 628 parts In-Stock

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$0.971

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$0.893

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628

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$0.893

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IDEA Electronic Components Group

UK . 1,275 parts In-Stock

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$0.991

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$0.892

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1,275

$0.991

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$0.892

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ChromeModa Solutions

Germany . 743 parts In-Stock

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$0.991

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$0.813

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743

$0.991

$0.813

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One Stop Electronics

USA . 1,449 parts In-Stock

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$6.410

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1,449

$6.410

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AZTECH Wire

Italy . 576 parts In-Stock

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$16.810

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Perfect Parts

USA . 3,788 parts In-Stock

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Corphita

USA . 2,178 parts In-Stock

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Microchip USA

USA . 220 parts In-Stock

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Overview

Discover unparalleled performance and reliability with the TLV2252QDREP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments provides top-quality operational amplifiers that are perfect for a wide range of applications. From automotive to industrial uses, this amplifier offers exceptional value and benefits to customers looking for precision, efficiency, and low power consumption. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the TLV2252QDREP and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the operational amplifier, making it suitable for various environmental conditions.

Maximum Input Offset Voltage: 1750 uV

Low input offset voltage ensures accurate amplification of the input signal without distortion, making this operational amplifier suitable for precision applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and reducing production costs.

Nominal Common Mode Reject Ratio: 75 dB

High common-mode rejection ratio ensures that the amplifier can effectively reject common-mode noise present in the input signal, resulting in a clean output signal.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this operational amplifier suitable for low power and battery-operated applications.

Minimum Slew Rate: 0.05 V/us

The fast slew rate enables the operational amplifier to respond quickly to changes in the input signal, making it ideal for applications requiring high-speed signal processing.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this operational amplifier can withstand elevated operating conditions, making it suitable for a wide range of industrial applications.

Technology: CMOS

The CMOS technology used in this operational amplifier offers low power consumption and high input impedance, making it energy-efficient and suitable for low-power applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2252QDREP attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

187 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

1750 uV

Minimum Voltage Gain:

10000

Minimum Slew Rate:

0.05 V/us

Nominal Slew Rate:

0.1 V/us

Peak Bias Current:

1 nA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

16 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

150 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2252QDREP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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