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TLV2252AIDG4

Texas Instruments

TLV2252AIDG4 by Texas Instruments

TLV2252AIDG4 by Texas Instruments is a dual operational amplifier with 850uV max input offset voltage, 0.001uA max average bias current, and 83dB nominal CMRR. Ideal for automotive applications due to its low-bias and micropower features, it operates at -40 to 125 °C with a supply voltage of +-1.35/+-4/2.7/8 V.

Median Price

$1.430

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 38 parts In-Stock

1+ parts

-

100+ parts

$1.430

1k+ parts

$1.280

10k+ parts

$1.200

38

-

$1.430

$1.280

$1.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,822 parts In-Stock

1+ parts

$1.425

100+ parts

-

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4,822

$1.425

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Chip Stock

USA . 29,430 parts In-Stock

1+ parts

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29,430

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Vyrian

USA . 8,002 parts In-Stock

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8,002

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Cogito LLC

Ukraine . 95 parts In-Stock

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95

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Distributors (Availability)

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Corphita

USA . 2,082 parts In-Stock

1+ parts

$1.350

100+ parts

-

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2,082

$1.350

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Parana Technologies

USA . 1,987 parts In-Stock

1+ parts

$2.539

100+ parts

-

1k+ parts

$3.028

10k+ parts

-

1,987

$2.539

-

$3.028

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DigiPath Technology Company

USA . 2,106 parts In-Stock

1+ parts

$2.796

100+ parts

-

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2,106

$2.796

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ChromeModa Solutions

Germany . 3,218 parts In-Stock

1+ parts

$2.853

100+ parts

$2.339

1k+ parts

-

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3,218

$2.853

$2.339

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IDEA Electronic Components Group

UK . 804 parts In-Stock

1+ parts

$2.853

100+ parts

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$2.568

10k+ parts

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804

$2.853

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$2.568

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AZTECH Wire

Italy . 134 parts In-Stock

1+ parts

$17.270

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134

$17.270

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A-Z Elektronik GmbH

Germany . 5,135 parts In-Stock

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5,135

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Microchip USA

USA . 1,225 parts In-Stock

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Perfect Parts

USA . 515 parts In-Stock

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Overview

Discover the TLV2252AIDG4 by Texas Instruments, a high-quality operational amplifier designed to deliver unmatched performance in a compact package. With its advanced technology and innovative design, this product is ideal for a wide range of applications in automotive and industrial settings. Experience the benefits of low bias current, micropower operation, and superior frequency compensation, all packaged in a convenient small outline format. Trust in Texas Instruments to provide reliable and efficient solutions that exceed expectations. Elevate your projects with the TLV2252AIDG4 and unleash the full potential of your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for use in a variety of applications.

Maximum Input Offset Voltage: 850 uV

Low input offset voltage ensures accurate signal processing with minimal errors.

Surface Mount: YES

Surface mount option allows for easy and compact installation on PCBs.

Nominal Common Mode Reject Ratio: 83 dB

High common mode rejection ratio helps in minimizing noise and interference in the signal.

Maximum Supply Voltage Limit: 16 V

Wide supply voltage range allows for flexibility in powering the op amp.

Minimum Slew Rate: 0.05 V/us

Fast slew rate ensures quick response to input signal changes.

Micropower: YES

Micropower design ensures low power consumption, making it suitable for power-sensitive applications.

Nominal Unity Gain Bandwidth: 200 kHz

High unity gain bandwidth allows for stable operation at various gain settings.

Technology: CMOS

CMOS technology offers high input impedance and low power consumption, enhancing overall performance.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is versatile and can be used in various circuit configurations.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2252AIDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±4/2.7/8 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

200 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

83 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

850 uV

Minimum Voltage Gain:

10000

Minimum Slew Rate:

0.05 V/us

Nominal Slew Rate:

0.12 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

1 nA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

16 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

125 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2252AIDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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