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TLV2242IDGKRG4

Texas Instruments

TLV2242IDGKRG4 by Texas Instruments

TLV2242IDGKRG4 by Texas Instruments is a dual operational amplifier with 4500uV max input offset voltage, 100dB CMRR, and 5.5kHz unity gain bandwidth. Ideal for automotive applications due to its low-bias current, micropower feature, and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,910 parts In-Stock

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5,910

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Digiode

USA . 3,208 parts In-Stock

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3,208

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Nova Conductors

Japan . 53 parts In-Stock

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53

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Distributors (Availability)

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Ampacity Inc.

Singapore . 778 parts In-Stock

1+ parts

$0.410

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778

$0.410

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Parana Technologies

USA . 20 parts In-Stock

1+ parts

$1.880

100+ parts

-

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$2.425

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20

$1.880

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$2.425

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DigiPath Technology Company

USA . 45 parts In-Stock

1+ parts

$2.070

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$1.904

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45

$2.070

$1.904

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ChromeModa Solutions

Germany . 6,747 parts In-Stock

1+ parts

$2.112

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$1.732

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6,747

$2.112

$1.732

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IDEA Electronic Components Group

UK . 1,897 parts In-Stock

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$2.112

100+ parts

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$1.901

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1,897

$2.112

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One Stop Electronics

USA . 990 parts In-Stock

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$9.410

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990

$9.410

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AZTECH Wire

Italy . 752 parts In-Stock

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$19.434

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752

$19.434

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Component Stockers USA

USA . 697 parts In-Stock

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$99.990

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697

$99.990

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A-Z Elektronik GmbH

Germany . 4,691 parts In-Stock

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Microchip USA

USA . 1,406 parts In-Stock

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Kepictronics

USA . 812 parts In-Stock

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Corphita

USA . 439 parts In-Stock

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Aranea Global

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Overview

Upgrade your electronic designs with the TLV2242IDGKRG4 by Texas Instruments. As a renowned manufacturer in the industry, Texas Instruments delivers top-notch operational amplifiers that provide unparalleled performance and reliability. Ideal for a wide range of applications, this op amp offers exceptional value with low bias current and micropower features. Experience high-quality amplification with the TLV2242IDGKRG4 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the operational amplifier, ensuring long-term reliability.

Maximum Input Offset Voltage: 4500 uV

Low input offset voltage helps reduce errors in the output signal, making this operational amplifier suitable for precision applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Nominal Common Mode Reject Ratio: 100 dB

High common mode rejection ratio helps minimize noise interference in the input signal, improving overall signal accuracy.

Nominal Supply Voltage / Vsup (V): 2.7

Low supply voltage requirement makes this operational amplifier energy-efficient and suitable for battery-powered applications.

Max Operating Temperature: 125 °C

Wide operating temperature range allows for reliable performance in various environmental conditions, including automotive applications.

Minimum Voltage Gain: 100000

High voltage gain enables this operational amplifier to amplify weak input signals effectively, making it suitable for signal conditioning applications.

Technology: BIPOLAR

Bipolar technology offers high accuracy and stability, making this operational amplifier ideal for precise measurement and sensor interface applications.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is designed for linear signal amplification and processing, making it versatile for various electronic applications.

Terminal Pitch: 0.65 mm

Close terminal pitch allows for compact PCB layout and high-density integration, making this operational amplifier suitable for miniaturized electronic devices.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2242IDGKRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.25/±6/2.5/12 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.5 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

100 dB

Minimum Common Mode Rejection Ratio (CMRR ):

60 dB

Input Offset Voltage Limit:

4500 uV

Minimum Voltage Gain:

100000

Nominal Slew Rate:

2000 V/us

Maximum Input Offset Current (IIO):

250 pA

Peak Bias Current:

1 nA

Maximum Bias Current (IIB) @25 °C:

500 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

16.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

2.5 μA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

TLV2242IDGKRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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