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TLV2241CDG4

Texas Instruments

TLV2241CDG4 by Texas Instruments

TLV2241CDG4 by Texas Instruments is an Operational Amplifier with 4500uV Max Input Offset Voltage, 100dB CMRR, and 5.5kHz Unity Gain Bandwidth. Ideal for low-power applications in commercial temperature range due to its micropower feature and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,006 parts In-Stock

1+ parts

-

100+ parts

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7,006

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Digiode

USA . 1,118 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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1,118

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,356 parts In-Stock

1+ parts

$3.733

100+ parts

-

1k+ parts

$4.232

10k+ parts

-

1,356

$3.733

-

$4.232

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ChromeModa Solutions

Germany . 374 parts In-Stock

1+ parts

$4.194

100+ parts

$3.439

1k+ parts

-

10k+ parts

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374

$4.194

$3.439

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IDEA Electronic Components Group

UK . 182 parts In-Stock

1+ parts

$4.194

100+ parts

-

1k+ parts

$3.775

10k+ parts

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182

$4.194

-

$3.775

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One Stop Electronics

USA . 843 parts In-Stock

1+ parts

$7.410

100+ parts

-

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10k+ parts

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843

$7.410

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AZTECH Wire

Italy . 295 parts In-Stock

1+ parts

$14.374

100+ parts

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295

$14.374

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Corphita

USA . 975 parts In-Stock

1+ parts

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975

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Microchip USA

USA . 235 parts In-Stock

1+ parts

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235

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DigiPath Technology Company

USA . 21 parts In-Stock

1+ parts

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100+ parts

$3.781

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21

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$3.781

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Overview

Experience unparalleled performance and reliability with the TLV2241CDG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Operational Amplifiers that are ideal for a wide range of applications. With its compact design and advanced technology, this Op Amp offers customers exceptional value, precision, and efficiency. Whether you're working on audio equipment, sensor interfaces, or any other electronic project, the TLV2241CDG4 is the perfect choice for achieving superior results. Elevate your designs with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good electrical insulation and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 4500 uV

Low input offset voltage ensures accuracy in signal amplification and processing.

Maximum Average Bias Current (IIB): 0.00055 uA

Low bias current helps in minimizing power consumption and improving overall performance.

Surface Mount: YES

Allows for easy and convenient installation on printed circuit boards, saving space and facilitating automated assembly.

Package Shape: RECTANGULAR

Standard rectangular shape fits well in a variety of electronic applications and allows for efficient PCB layout.

Nominal Common Mode Reject Ratio: 100 dB

High common mode rejection ratio ensures that common mode noise is effectively suppressed, leading to clean and accurate signal transmission.

Nominal Supply Voltage / Vsup (V): 2.7

Optimal supply voltage level for efficient operation and reliable performance.

Power Supplies (V): +-1.25/+-6/2.5/12

Supports a range of power supply voltages, making it versatile and adaptable to different system requirements.

No. of Terminals: 8

Provides necessary connections for input and output signals, power supply, and other functions, making it a complete and integrated solution.

Package Style (Meter): SMALL OUTLINE

Compact and space-saving package design suitable for applications where board space is limited.

Maximum Supply Voltage Limit: 16.5 V

Ensures protection against overvoltage conditions, enhancing the operational amplifier's lifespan and durability.

Maximum Operating Temperature: 70 °C

Capable of functioning reliably in a wide range of temperature environments.

Minimum Voltage Gain: 30000

High minimum voltage gain ensures strong signal amplification capabilities.

Minimum Operating Temperature: 0 °C

Can operate efficiently even at low temperatures, making it suitable for a variety of environmental conditions.

Terminal Position: DUAL

Dual terminal position allows for flexible connection options within the circuit layout.

Maximum Seated Height: 1.75 mm

Low profile design for applications where height restrictions are a concern.

Width: 3.905 mm

Narrow width enables close spacing on PCBs and facilitates compact circuit designs.

Micropower: YES

Designed for low-power applications where power efficiency is critical.

Length: 4.9 mm

Compact length helps in achieving a small overall footprint on the PCB.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications where extended temperature ranges are not required.

Low-Bias: YES

Low bias current improves accuracy and stability in signal processing and amplification applications.

Nominal Unity Gain Bandwidth: 5.5 kHz

Nominal bandwidth suitable for various audio and signal processing applications.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise performance for precise signal amplification.

Terminal Form: GULL WING

Gull wing terminal form enables easy and secure soldering during assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for amplifying and processing signals in a wide range of electronic circuits and systems.

Maximum Supply Current: 0.00155 mA

Low maximum supply current consumption for efficient power management.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture ensures stability, accuracy, and high performance in signal amplification applications.

Packing Method: TUBE

Secure packing method for convenient storage, handling, and transportation of operational amplifiers.

Nominal Slow Rate: 2000 V/us

Nominal slew rate enables fast response and signal processing capabilities.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration into various PCB layouts and designs.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2241CDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.25/±6/2.5/12 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.5 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

100 dB

Input Offset Voltage Limit:

4500 uV

Minimum Voltage Gain:

30000

Nominal Slew Rate:

2000 V/us

Peak Bias Current:

550 pA

Maximum Bias Current (IIB) @25 °C:

500 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

16.5 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

1.55 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.905 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2241CDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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